Experimental Investigation on Brittle-Ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon

Gao, Yu Fei; Ge, Pei Qi

doi:10.4028/www.scientific.net/kem.431-432.265

Cited by 7 publications

(5 citation statements)

References 5 publications

(6 reference statements)

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“…The theoretical average cut depths of grits calculated in Table 1 are less than the practical grits average cut depths, due to assuming that all grits taking part in the cutting in theoretical calculation. According to foregoing analysis, the calculation results of No.6, 8, 10, 11 and 12 in Table 1 show there may be ductile regime material removal, which is basically in accordance with the experimental results in references [1].…”

Section: Relationship Between Average Grit Cut Depth and Wire Sawing ...supporting

confidence: 86%

“…Material Removal Model of Grit Cut. In the process of FADWS slicing single crystal silicon, the material removal and chip formation are main in a brittle regime, through brittle cracks intervening and propagating [1]. And the machining process of single diamond grit which is on the wire surface is similar to the single point diamond turning, and the diamond grit has a negative rake, so the diamond grit was assumed as a cone [2].The material removal model of single grit is shown in Fig.…”

Section: Theoretical Analysis Of Grit Cut Depth In Fadws Slicing Sing...mentioning

confidence: 99%

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Analysis of Grit Cut Depth in Fixed-Abrasive Diamond Wire Saw Slicing Single Crystal Silicon

Gao

2011

SSP

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A mathematical model to calculate the grit average cut depth in wire sawing single crystal silicon was founded. So the grit average cut depths were calculated theoretically by choosing different process parameters, and influences of process parameters on grit cut depths of slicing silicon crystal were analyzed. Analysis results indicate that the grit average cut depth relates to the silicon mechanical properties, grit shape and size, wire speed and ingot feed speed, etc. And there is a monotone increasing non-linear correlation between grit average cut depth and the ratio i value of ingot feed speed and wire speed, when the i value is lower, the average grit cut depth is lower.

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Section: Relationship Between Average Grit Cut Depth and Wire Sawing ...supporting

confidence: 86%

Section: Theoretical Analysis Of Grit Cut Depth In Fadws Slicing Sing...mentioning

confidence: 99%

Analysis of Grit Cut Depth in Fixed-Abrasive Diamond Wire Saw Slicing Single Crystal Silicon

Gao

2011

SSP

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“…The cost of such a cutting takes a con siderable part of the total cost of the plate production. Because of this the investigations of methods to cut with a steel wire, which should combine a high productivity and surface quality attained in ductile removal of the material are the topical task [129][130][131][132][133][134][135]. Up to now, according to the literature, the methods of wire cutting brittle materials, which fully realized ductile mode of cutting, are not developed yet.…”

Section: Ductile Removal Of a Materials In Cutting Brittle Materials Wmentioning

confidence: 99%

“…Up to now, according to the literature, the methods of wire cutting brittle materials, which fully realized ductile mode of cutting, are not developed yet. However, it is indicated that the mechanism of silicon removing in wire cutting may be totally brittle, partially brittle, and near ductile [129][130][131]134]. A totally ductile mode of removing silicon with a diamond wire is described in a theoretical model only [130].…”

Section: Ductile Removal Of a Materials In Cutting Brittle Materials Wmentioning

confidence: 99%

Studies of the ductile mode of cutting brittle materials (A review)

Kovalchenko

2013

J. Superhard Mater.

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Theoretical and experimental studies of the ductile mode of cutting brittle materials (semicon ductors, ceramics, and glass) have been considered. The ductile mode of cutting has been based on the implementation of high pressure induced phase transformations in a material machined that followed by a cutting of a transformed amorphous layer, which makes it possible to avoid cracking. Publications on studies of phase transitions in brittle materials in the course of the indentation, scratching, friction, and cutting have been reviewed. It has been shown that the cutting depth, cutting edge radius of a tool, chip thickness, tool cutting edge inclination, and crystallographic orientation of a material machined and dia mond tool as well as a type of lubricoolant are the decisive factors in implementing the ductile mode of cutting. KOVALCHENKO 1 2 Cutting length 3 4 Resistance force, N Fig. 3. Scheme of different modes of removing a brittle material with increasing normal load and cutting depth [42]: elastic (1) and elastoplastic (2) deformations, plastic (3) and brittle (4) removal of the material.

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“…The results indicated that a higher surface roughness was observed at the lowest wire speed, whereas the surface roughness varied at different crystal orientations with the same wire speed. Gao and Ge [25] studied the material removal mode on monocrystalline silicon. Their findings showed that the feed rate over the wire speed ratio has a solid relationship with the material removal mode.…”

Section: Introductionmentioning

confidence: 99%

Multi-objective optimization of energy consumption, surface roughness, and material removal rate in diamond wire sawing for monocrystalline silicon wafer

Sefene,

Chen

2023

Int J Adv Manuf Technol

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Sustainable manufacturing is essential to minimize energy consumption and environmental footprints in manufacturing operations. In diamond wire sawing (DWS) process, minimizing energy consumption without compensating for surface roughness of sawn wafer is crucial for achieving a cost-effective and environmentally friendly process. This study aims to find the correlation between energy consumption (EC), surface roughness (Ra), and material removal rate (MRR) during the single DWS process. Experiments have been conducted on monocrystalline silicon (Si) incorporating various process parameters, including wire speed, feed rate, and wire tension as controllable factors. A mathematical relationship between the parameters is formulated using the response surface methodology and optimized by using a multi-objective particle swarm optimization. Results revealed that a wire speed of 0.36 m/sec, feed rate of 0.029 mm/min, and wire tension of 7 N are the optimum parameters for the multi-objective quality criterion, and the variations between the predicted and the confirmation experiment is below 10%. These findings can be applied to the multi-wire DWS of Si wafer processing for promoting sustainable manufacturing practices.

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Experimental Investigation on Brittle-Ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon

Cited by 7 publications

References 5 publications

Analysis of Grit Cut Depth in Fixed-Abrasive Diamond Wire Saw Slicing Single Crystal Silicon

Analysis of Grit Cut Depth in Fixed-Abrasive Diamond Wire Saw Slicing Single Crystal Silicon

Studies of the ductile mode of cutting brittle materials (A review)

Multi-objective optimization of energy consumption, surface roughness, and material removal rate in diamond wire sawing for monocrystalline silicon wafer

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