Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Elec 2012
DOI: 10.1115/ht2012-58396 View full text |Buy / Rent full text

Abstract: The trends of decrease in size and increase in power dissipation for micro-electronic systems present a significant challenge for thermal management of modern electronics. The preferable cooling solution could be micro heat exchangers based on forced flow boiling. Nanoparticle deposition can affect nucleate boiling heat transfer coefficient via alteration of surface thermal conductivity, roughness, capillary wicking, wettability, and nucleation site density. It can also affect heat transfer by changing bubble … Show more

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