Excimer laser-induced modification in PMMA/Ni-acetylacetonate films for selective metallization

Kolev, K.; Jadin, Alain; Benbakoura, S; Laude, L.D.

doi:10.1016/s0169-4332(98)00437-1

Cited by 13 publications

(6 citation statements)

References 5 publications

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“…Composite materials are particularly important in the plating of carbon steel surfaces, because of the versatility achievable by the use of chemical additives, like phosphates and acetylacetonates (Gezerman et al, 2013). Undissolved particles in the electroless plating solution can however affect the thickness of the final plating layer, which compromises hardness, abrasion, corrosion properties, and oxidation resistance at high temperature (Kolev et al, 1999). Recent developments in Ni-TiO2 plating techniques are based on the use of phosphate salts and Al2O3 (Yongfeng et al, 2017).…”

Section: Introductionmentioning

confidence: 99%

Ni-P-Acetylacetonate-TiO2 Composite Plating with Electroless Plating: Plating Parameters and Corrosion Resistance

Çorbacıoğlu

2019

Uluslararası Muhendislik Arastirma Ve Gelistirme Dergisi

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In this study, the chemical plating parameters for NiP -acetylacetonate-TiO2 composite particles and the corrosion resistances of the deposition layer obtained by electroless plating are investigated. The effects of the TiO2 concentration, process time, temperature, and pH of the plating materials are examined, and optimal parameters are determined. The corrosion resistance of samples obtained by NiP -acetylacetonate-TiO2 composite plating is assessed by comparison to a Ni plating layer, and it is found to be superior to that of both the Ni plating layer and the NiP plating layer NiP plating layers in a 3.5% NaCl salt spray, as well as in 15% H2SO4 and 20% HCl solutions. The origin of this corrosion resistance in composite plating layers is discussed.

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Section: Introductionmentioning

confidence: 99%

Ni-P-Acetylacetonate-TiO2 Composite Plating with Electroless Plating: Plating Parameters and Corrosion Resistance

Çorbacıoğlu

2019

Uluslararası Muhendislik Arastirma Ve Gelistirme Dergisi

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“…It consists in application of organic and inorganic metal compounds (precursors) into the polymer matrix at the stage of composite manufacturing, and next in laser irradiation. As a result of laser irradiation polymer matrix is ablated, whereas heavier metal atoms extracted from precursors remain on the polymer surface and can catalyse electroless metallization [20][21][22].…”

Section: Introductionmentioning

confidence: 99%

Application of thermogravimetry in the assessment of coatings ability to be metallized

Rytlewski

Mróz

Budner

et al. 2016

J Therm Anal Calorim

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The main aim of this work was to assess the ability of thermogravimetric method to predetermine the surface activation properties of the coatings intended for laser-assisted electroless metallization. In this technique of metallization, surface of polymer material has to be activated before immersing in electroless metallization bath. Surface activation may consist in compositional modification of polymer material and in laser irradiation. In this work, polyurethane or epoxy coatings containing copper(I) oxide and copper(II) acetylacetonate or copper hydroxide were laser irradiated and then electrolessly metallized. Surface activation properties are evaluated usually by means of optical imaging, scanning electron microscopy, energy-dispersive X-ray spectroscopy and Fourier transform infrared spectroscopy. In this work, an attempt was made to evaluate these properties based on thermogravimetric measurements.

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“…5,6 Through a copper deposition on the silicon substrate using a focused Ar ϩ laser (λ ϭ 514.5 nm, continuous wave (CW)) beam, it is possible to realize microscale line width and selective, fine shape lines. 7 Micropatterned copper films were obtained on the silicon substrate by laser-induced deposition using copper formate (Cu(HCOO) 2 ·4H 2 O) as a precursor.…”

Section: Introductionmentioning

confidence: 99%

Surface modification of silicon by laser surface treatment: Improvement of adhesion and copper deposition

Lee

Kim

et al. 2005

Journal of Elec Materi

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We have studied the use of lasers for modifying the surface properties of silicon to improve its wettability and adhesion characteristics. Using a 4th harmonic Nd:YAG (λ ϭ 266 nm, pulse) laser, the wettability and adhesion characteristics of the silicon surfaces have been enhanced by laser irradiation. It was found that laser surface treatment of silicon modified the surface energy. By the contact angle measurement, using distilled water, the wetting characteristics of silicon after the laser irradiation show a decrease in the contact angle and a change in the surface chemical composition. In the case of the laser-treated silicon surface, laser direct writing of copper lines has been achieved through pyrolytic decomposition of copper formate by using a focused Ar ϩ laser beam (λ ϭ 514.5 nm, continuous wave (CW)) on the silicon substrates. The deposited lines and surface chemical compositions were measured by energy dispersive x-ray (EDX), scanning electron microscopy (SEM), x-ray photoelectron spectroscopy (XPS), and surface profiler (Alpha Step 500, San Jose, CA) to examine the cross section of deposited copper lines.

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Excimer laser-induced modification in PMMA/Ni-acetylacetonate films for selective metallization

Cited by 13 publications

References 5 publications

Ni-P-Acetylacetonate-TiO2 Composite Plating with Electroless Plating: Plating Parameters and Corrosion Resistance

Ni-P-Acetylacetonate-TiO2 Composite Plating with Electroless Plating: Plating Parameters and Corrosion Resistance

Application of thermogravimetry in the assessment of coatings ability to be metallized

Surface modification of silicon by laser surface treatment: Improvement of adhesion and copper deposition

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