2013
DOI: 10.1002/pssa.201329015
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Excess carrier lifetime and strain distributions in a 3C-SiC wafer grown on an undulant Si substrate

Abstract: In this study, we have used the microwave photoconductivity decay method to map excess carrier lifetimes in a n‐type 3C‐SiC wafer grown on an undulant Si substrate. We compared these lifetime maps with the distributions of strains and defects, which were observed using optical microscopy, Raman spectroscopy and pit distributions after molten NaOH etching. We found that excess carrier lifetimes in strained regions, which exhibit high densities of defects, are short. We also found that carrier lifetimes in strai… Show more

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Cited by 2 publications
(1 citation statement)
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“…These apparatuses are the same as those used in our previous µ-PCD measurements. 11,15,[27][28][29][30] We observed the reflected microwave signal immediately after excitation (a peak µ-PCD signal) as a function of the injected photon density, which was controlled by rotating a λ=2 plate positioned before a Glan prism. For the excitation of a small area within the sample, we inserted a ceramic pinhole with various sizes near the excitation side of the sample.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…These apparatuses are the same as those used in our previous µ-PCD measurements. 11,15,[27][28][29][30] We observed the reflected microwave signal immediately after excitation (a peak µ-PCD signal) as a function of the injected photon density, which was controlled by rotating a λ=2 plate positioned before a Glan prism. For the excitation of a small area within the sample, we inserted a ceramic pinhole with various sizes near the excitation side of the sample.…”
Section: Experimental Methodsmentioning
confidence: 99%