2013
DOI: 10.1016/j.ijhydene.2013.09.044
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Evaluation of the oxidation and Cr evaporation properties of selected FeCr alloys used as SOFC interconnects

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Cited by 180 publications
(78 citation statements)
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“…Linder et al found that Crofer 22 APU oxide layer thickness was about 5 mm for similar exposure time at 850 C in air[25]. Sachitanand et al found that Crofer 22 APU oxide layer thickness was about 12e16 mm at 850 C in humidified air after 1000 h[29].The results presented in…”
mentioning
confidence: 88%
“…Linder et al found that Crofer 22 APU oxide layer thickness was about 5 mm for similar exposure time at 850 C in air[25]. Sachitanand et al found that Crofer 22 APU oxide layer thickness was about 12e16 mm at 850 C in humidified air after 1000 h[29].The results presented in…”
mentioning
confidence: 88%
“…Holcomb and Alman [24] suggested that the alloys containing Ti and Mn reduce further the formation of volatile Cr oxyhydroxide from the scale due to the formation of outer layers of TiO 2 or Cr-Mn spinels. Sachitanand et al [25] reported that higher Mn contents in the steel lead to lower Cr evaporation. When Mn content is high enough, lower Cr volatilisation is observed; nevertheless, higher Mn concentration in the oxide scale shows higher mass gain and the formation of thicker MnCr 2 O 4 spinel layer.…”
Section: Ni-based Alloysmentioning
confidence: 99%
“…8(c). It is worth noting that the presence of MneCr oxide layer prevents [16,43] are often applied to the surface of the interconnects to hinder the diffusion [17]and evaporation [20,21] of Cr from the interconnects. However, Mahapatra et al reported the severe reaction between instable (Mn,Co) 3 O 4 spinel coating and sealing glass, which led to the degradation of the interfacial compatibility [43].…”
Section: Glass/metal Interfacial Reactionmentioning
confidence: 99%