2011
DOI: 10.7567/jjap.50.010111
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Evaluation of Strained-Silicon by Electron Backscattering Pattern Measurement: Comparison Study with UV-Raman Measurement and Edge Force Model Calculation

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Cited by 12 publications
(7 citation statements)
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“…On the other hand, the Raman measurement has higher spatial resolution and evaluation speed. 30,31) In other words, IXS and Raman measurements are both useful for evaluating the group IV alloy macrostructures with high thermal conductivity resolution and their nanostructures with high spatial resolution.…”
Section: Bulkmentioning
confidence: 99%
“…On the other hand, the Raman measurement has higher spatial resolution and evaluation speed. 30,31) In other words, IXS and Raman measurements are both useful for evaluating the group IV alloy macrostructures with high thermal conductivity resolution and their nanostructures with high spatial resolution.…”
Section: Bulkmentioning
confidence: 99%
“…There are several strain evaluation techniques including convergent-beam electron diffraction (CBED), 8,9) X-ray diffraction (XRD), 10,11) and electron backscattering pattern (EBSP). 12) In particular, it has been reported that Raman spectroscopy is a powerful strain evaluation technique, because it has advantages such as a nondestructive measurement and a high spatial resolution. [13][14][15][16][17][18][19][20][21] To evaluate strain in Si 1−x Ge x by Raman spectroscopy quantitively, phonon deformation potentials (PDPs) are necessary for a conversion from a Raman wavenumber shift to a stress value.…”
Section: Introductionmentioning
confidence: 99%
“…There are several evaluation techniques for strain induced in semiconductor materials, such as, X-ray diffraction (XRD), electron back-scattering diffraction, Raman spectroscopy, transmission electron microscopy (TEM), and hard X-ray photoemission spectroscopy. [12][13][14][15][16][17][18][19] Among these techniques, Raman spectroscopy is one of the most effective techniques for the strain evaluation of crystals as nondestructive and contactless measurements, and it has a relatively high spatial resolution. [20][21][22] It is essential to prove the uniaxial stress states in the compressively strained SiGe layers fabricated by selective ion implantation because the large uniaxial stress induced in SiGe efficiently leads to the improvement of the drive current of devices.…”
Section: Introductionmentioning
confidence: 99%