Evaluating predictive scheme for thermomechanical properties of Si-diamond composites

Abstract

A kind of multiscale correlational constitutive model without tunable parameter was developed to predict the thermomechanical properties of Si-diamond composites, including the effective elastic modulus, effective bulk modulus, effective shear modulus, effective Poisson’s ratio, coefficients of thermal expansion, as well as thermal conductivity. Based on this model, the effective thermomechanical response of composites was simulated, and the mechanism of thermomechanical coupling of constituents were also evaluated. The results were shown that the effective elastic properties of composites, such as effective elastic modulus, effective bulk modulus, effective shear modulus, increased with diamond and SiC, and that the introduction of dispersed diamond with high thermal conductivity and low thermal expansion resulted in improvement of thermal response and heat transport of Si-diamond-SiC composites, the thermomechanical coupling of which was inspired by the effective elastic properties of composites and mismatch between intrinsic properties of constituents.