2019
DOI: 10.1002/mmce.22040
|View full text |Cite
|
Sign up to set email alerts
|

Enhancement of Johnson figure of merit in III‐V HEMT combined with discrete field plate and AlGaN blocking layer

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

0
12
0

Year Published

2020
2020
2024
2024

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 21 publications
(12 citation statements)
references
References 18 publications
0
12
0
Order By: Relevance
“…Figure10shows the comparison of J-FOM (= fT × BVgd) as a function of the gate length for various GaN-based HEMTs[20,21,[29][30][31][32][33][34][35][36][37][38][39][40][41][42][43]. The MIS-HEMTs that were fabricated in this study exhibited the J-FOM in the range between 5.57 and 10.67 THz•V, which are the state-of-the-art values reported for GaN-based HEMTs.…”
mentioning
confidence: 71%
See 1 more Smart Citation
“…Figure10shows the comparison of J-FOM (= fT × BVgd) as a function of the gate length for various GaN-based HEMTs[20,21,[29][30][31][32][33][34][35][36][37][38][39][40][41][42][43]. The MIS-HEMTs that were fabricated in this study exhibited the J-FOM in the range between 5.57 and 10.67 THz•V, which are the state-of-the-art values reported for GaN-based HEMTs.…”
mentioning
confidence: 71%
“…Therefore, the trade-off relationship must be carefully considered while employing the recessed MIS gate structure. In this study, we have investigated the effects of the gate recess depth on the DC and RF characteristics of recessed AlGaN/GaN MIS-HEMTs with an aluminum oxynitride (AlOxNy) MIS gate; the performance was evaluated using Johnson's figure of merit (J-FOM = fT × BVgd), which is the norm for evaluating high-frequency power transistors [20,21]. AlOxNy films can be deposited while using various deposition techniques, among which plasma enhanced atomic layer deposition (PEALD) is a good choice for producing high quality thin films [22].…”
Section: Experimental Methodsmentioning
confidence: 99%
“…Recently, many articles have been devoted to HEMT structure design improved by the introduction of AlGaN back barrier (BB) layer [9][10][11][12][13][14][15]. AlGaN has been used as a buffer layer of HEMT structures for a long time, especially for growth on Si substrates.…”
Section: Introductionmentioning
confidence: 99%
“…However, traps in high-resistivity GaN negatively influence the frequency characteristics of HEMT structures, since trapping and releasing electrons by deep traps is a rather slow process which decreases the cutoff frequency. Recently, AlGaN BB was suggested to separate electrons in two dimensional electron gas (2DEG) from traps in buffer layers and improve transistor characteristics, such as increased I on /I off ratio and suppressed leakage current [9], enhanced power performance [10], increased drain current (700 mA mm −1 ), improved transconductance (143 mS mm −1 ), suppressed current collapse (12%) [11] or in complex, increased Johnson figure of merit [12]. AlGaN BB also helps to improve the short-channel problem when InAlN barrier is used [13].…”
Section: Introductionmentioning
confidence: 99%
“…This can operate at extremely high frequencies, and has high breakdown efficiency with high saturation velocity of electrons 1‐3 . The GaN devices exhibit predominant power operation in relation to the more established GaAs‐based HEMT and became the innovation of choice for current and future utilizations 4‐6 . For any type of technique, radio points of interest have standards of response to be achieved with two interfering frequency domain signals spaced out that their third‐order intermodulation distortion (IMD 3 ) may come down on peak of the relevant signal.…”
Section: Introductionmentioning
confidence: 99%