Enhanced toughness and thermal properties of bismaleimide resin based on the synergistic effect of reactive amino‐terminal poly(phthalazinone ether nitrile sulfone) and bisallyl bearing diphenol group

Abstract

Bismaleimide (BMI) resins have poor toughness due to their high crosslink density, which limits their wide development and application. In this study, the amino‐terminated poly(phthalazinone ether nitrile sulfone) (PPENS‐DA) resin was designed and the curing agent of 3,3′‐diallyl‐4,4′‐biphenol (DABP) was synthesized to toughen N,N′‐(4,4′‐diphenylmethane) bismaleimide (BDM) resin. The impact strength, flexural strength and fracture surface structures of the DABP/BDM and PPENS‐DA/DABP/BDM blends were studied. The results showed that the notched impact strength of the blends with 10‐phr PPENS‐DA is 4.98 kJ/m2, which was 36% higher than that of pristine BDM/DABP blend and 200% higher than that of the 2,2′‐diallyl bisphenol A (DABPA) modified BMI resin system. The glass transition temperature (Tg) has been improved from 247 to 269°C for the blend system as evidenced by DMA. Rheological behavior analysis indicated that the blend system has a broad processing window (90‐175°C) with low viscosity of less than 1 Pa·s and low curing activation energy of 67.2 kJ/mol.

A Tailorable Series of Elastomeric‐To‐Rigid, Selfhealable, Shape Memory Bismaleimide

“…[ 22 ] The trans‐stretching vibration peak of the ether bond between the DPS monomer and the reaction product can be observed at 1240 cm −1 , indicating no change before and after the reaction. [ 23 ] The scissoring vibration peak of the primary amine (─NH 2 ) group, located at 1622 cm −1 , disappeared, while the secondary amine groups gradually increased, resulting in a broader and smoother stretching peak observed at 3350 cm −1 as shown in Figure S3 (Supporting Information). These observations confirm the structural characteristics of the cured resin.…”

High‐performance thermoplastic toughener for bismaleimide resin: Feature application of reactive polyarylether ketone bearing propenyl group

“…The toughness can be further improved by increasing the length of crosslinking points and reducing the crosslinking density. [10][11][12][13] Alternatively, other thermoset materials can be mixed with the BMI system by forming an interpenetrating network structure through controlling the amount of both materials.…”

Developing non‐halogen and non‐phosphorous flame retardant bismaleimide resin with high thermal resistance and high toughness through building crosslinked network with Schiff base structure

“…Bismaleimide resin, the typical representative of available HRTRs, occupied critical importance in high‐tech applications owing to its excellent heat resistance, chemical resistance, electrical insulation, wave transparency and dimensional stability 7,8 . Up to date, diphenylmethane bismaleimide (BDM) is the widely used and commercialized bismaleimide monomer, however it has high melting point and narrow processing window as well as big brittleness of cured resin, 9,10 so BDM should be modified for actual application. Allyl phenyl compounds are one type of outstanding modifiers for BDM, and 2,2′‐diallyl bisphenol A (DBA) is the right modifier for BDM resin 11 .…”