Electrothermal Bonding of Carbon Nanotubes to Glass

Abstract

Abstract:Applications that exploit the exceptional properties of carbon nanotubes at practical length scales almost invariably involve the fundamental issues of nanotube-to-surface contacts; indeed, interface properties often dominate mechanical, electrical and thermal performance in devices and materials based on CNTs. In this paper we present a method to attach carbon nanotubes to glass surfaces and investigate the mechanism of bonding at the interface. An electric field which induces migration of alkali ions from glass into carbon nanotubes, with a reversed polarity as compared to an analogous anodic bonding configuration, is employed to form a chemical bond between nanotubes and glass. We report a pull-off force of 4.35 N/cm 2 averaged over the bonded area, with the possibility of localized areas of higher bonding strength.

Comprehensive investigation of sequential plasma activated Si/Si bonded interfaces for nano-integration on the wafer scale

“…Figure 4 shows the I -V curves of the p-Si/p-Si bonded interface with different O 2 RIE plasma exposure times measured at RT. It has been reported [5] that sequential plasma activated wafers form covalent bonds across the bonded interface 24 h after bonding. Hence, the I -V measurements were done 24 h after bonding.…”

37.1: Manufacturing Carbon Nanotube Thin Film Transistor Using Industrial Conditions

“…The peel off force is estimated to be 4.35 N/cm 2 . 4 Therefore, carbon nanotube thin film will not be easily peeled off from substrates and consequently pollute the manufacturing lines. This information will dismiss engineers' concerns on manufacturing line pollutions.…”

Low temperature thermocompression bonding between aligned carbon nanotubes and metallized substrate

“…Moreover, the interface between nano clusters and the target substrate was hardly to identify, indicating that the CNT/metal clusters structure could bond well to the metal layer at a certain temperature and pressure. Compared with other transfer techniques, the nano thermocompression bonding technique can greatly decrease the bonding temperature and pressure, and shorten the bonding time, from more than 2 h to 20 min [10], indicating that atoms from nano clusters have higher diffusion rate than those from the metallized layer during bonding.…”

“…Interface resistance can be reduced effectively only when robust bonding between VACNTs and the target substrate is guaranteed. Several different methods of VACNT transfer between the growth substrate and target substrate have been demonstrated, including solder bonding [7,8], adhesive bonding [9], electrothermal bonding [10], chemical bonding [11] and thermocompression bonding [12][13][14]. As for solder bonding and adhesive bonding, solder paste or adhesive is firstly coated on the target substrate, when the temperature increases, the solder melts or the adhesive cures, and a robust bond between CNTs and the target substrate is promised.…”