Electrostatic parallelogram actuators

Takeshima, Naoto; Gabriel, K.J.; Ozaki, M.; Takahashi, Junichi; Horiguchi, Hiroko; Fujita, Hiroyuki

doi:10.1109/sensor.1991.148800

Cited by 61 publications

(21 citation statements)

References 6 publications

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“…The translation factor r ͑amplification ratio͒ is a function of the angle between the axes of the slanted V-shaped beam and the thermal expansion beam (rϭcot ). 19 We chose the angle to be 5°, as recommended in the literature, 20,21 so the amplification ratio of the devices r was 11.…”

Section: Principle Design and Fabricationmentioning

confidence: 99%

Realization of nanoscale resolution with a micromachined thermally actuated testing stage

Dikin

Zhang

et al. 2004

Review of Scientific Instruments

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The design, fabrication, and characterization of a microelectromechanical systems ͑MEMS͒ stressstrain device for testing the mechanical properties of nanomaterials is presented. Thermal actuation, with integrated motion amplification structures, was used to both minimize the operating temperature of the device as well as realize fine motion control over large displacements. The device has a working range from tens of nanometers up to 10 micrometers. Displacements as small as 30 nm per 10 mA input dc current increments were obtained for the first time with thermal actuators micromachined by deep reactive ion etching ͑DRIE͒. The height difference ͑offset͒ between the moving and fixed platforms was less than 40 nm over the entire working range of the device for the input power range studied. A 0.27 N force is predicted for an actuator displacement of 30 nm based on mechanical models of the device; the calculated force increases linearly up to 88 N for the maximum 9.7 m displacement. The operating characteristics obtained for this initial design suggest that this methodology will be useful in producing a variety of MEMS stress-strain stages custom designed to yield the force and displacement resolution necessary to test many nanomaterials and nanostructures.

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Section: Principle Design and Fabricationmentioning

confidence: 99%

Realization of nanoscale resolution with a micromachined thermally actuated testing stage

Dikin

Zhang

et al. 2004

Review of Scientific Instruments

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“…There are a variety of methods to prevent the surface-tension-induced collapse and stiction of surface microstructures during the final drying step. The released structures can be sublimation dried (e.g., freeze-dried [96]) using t-butyl alcohol [97] or methanol-water mixtures [98], dried with a supercritical CO technique [99], or dried by evaporation with the meniscus shaped by small features added to the perimeter of the microstructure [100] or by coating the released microstructures with hydrophobic selfassembling monolayer (SAM) films prior to removal from the aqueous stage [101]. Alternatively, a portion of the oxide layer can be substituted by a spun-on polymer spacer after a partial etch of the oxide.…”

Section: Microstructure Release and Surface Passivationmentioning

confidence: 99%

Surface micromachining for microelectromechanical systems

1998

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“…Recently, the basic understanding of this process has improved considerably [52,53] and models have been developed to predict etching times. In order to prevent surface-tension induced collapse and stiction during the final drying step, the wafer can be freeze-dried [54], dried with a supercritical CO2 technique [55], or dried by evaporation, but with the meniscus shaped by small features added to the perimeter of the microstructure [56]. Alternatively, a portion of the oxide layer can be substituted by a spun-on polymer spacer after a partial etch of the oxide.…”

Section: Microstructure Release and Surface Passivationmentioning

confidence: 99%

Recent Advances in Surface Micromachining

Howe

1996

IEEJ Trans. SM

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Abstract-Surface micromachining is the fabrication of micromechanical structures from deposited thin films. Although the process dates to the 1960s, this paper will survey its rapid extension over the past few years and its application to batch-fabrication of micromechanisms and of monolithic micro electromechanical systems (MEMS). Two central issues in surface micromachining are: (i) the understanding and control of the material properties of microstructural films, such as polycrystalline silicon, and (ii) the release of the microstructure, for example by wet-etching silicon dioxide sacrificial films, followed by the drying and surface passivation of the microstructure. Recent developments in hinged structures for postrelease assembly and high-aspect ratio fabrication of molded parts from deposited thin films promise to extend greatly the capabilities of surface micromachining technology.

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Electrostatic parallelogram actuators

Cited by 61 publications

References 6 publications

Realization of nanoscale resolution with a micromachined thermally actuated testing stage

Realization of nanoscale resolution with a micromachined thermally actuated testing stage

Surface micromachining for microelectromechanical systems

Recent Advances in Surface Micromachining

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