The electromechanical impedance method is one of the key structural health monitoring (SHM) technologies enabling real‐time in‐service assessment of structural condition. This SHM method utilizes permanently attached piezoelectric wafer active sensors and electromechanical impedance measurements for inferring dynamic characteristics (frequency response) of the host structure. Changes in the impedance signatures serve as a diagnostic for structural damage.
Providing a fundamental consideration of the sensor–structure impedance interaction, this article focuses on the analytical modeling of the sensor and structural dynamics participating in the cumulative impedance response. One‐dimensional models of the sensor and the host structure are discussed first to introduce the reader to the physical mechanisms of the electromechanical impedance method. Under applied harmonic excitation, expansion and contraction of the sensor results in longitudinal and flexural vibrations of the host structure that are accounted for in the model presented. For two‐dimensional structures, an axisymmetric problem is considered and an analytical formulation is derived for the electromechanical impedance as seen at the sensor terminals. Extensional and transverse dynamics of the plate structure are included in the model. Recent developments in impedance modeling are discussed and prospective new trends are suggested.