Electrocrystallization in pulse electrolysis

Ibl, N.; Puippe, J.-C.; Angerer, H.

doi:10.1016/0376-4583(78)90044-4

Cited by 167 publications

(83 citation statements)

References 6 publications

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“…Both the pulsating and stationary concentration boundary layers can be clearly described. Thus, the calculated results qualitatively agree with the duplex boundary layer theory [27,28], which also agree with the optical measurements of  1, =0.338 M at   =60 mA/cm 2 and  1, =0.223 M at   =120 mA/cm 2 [14]. It is noticed that the pulsating concentration boundary layer thickness δ  can be numerically estimated to be about 80 m, which is almost independent of the applied pulse current density.…”

Section: Resultssupporting

confidence: 83%

Ionic Mass Transfer Rate Accompanying Pulsed Current Electrodeposition of Silver

Kawai

Fukunaka

Kida

2010

Trans. Mat. Res. Soc. Japan

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Transient mass transfer rate of Ag + ion associated with natural convective electrolyte flow developing along the vertical plane electrodes immersed in a stagnant AgNO 3 aqueous electrolyte solution is numerically analyzed under both direct and pulsed current conditions. The cathodic concentration profile of Ag + ion caused by silver electrodeposition was measured by the holographic interferometer. Calculated results are compared with the measured values. Under direct current condition, it is found that quantitative agreement between calculated and measured results is obtained at the lower current density, while an obvious deviation is noticed at the higher one due to the laser beam deflection effect as well as the concentration dependence of transport properties. Additionally, it may be related to the fact that the effective cathode surface area apparently increases due to the roughening of the cathode surface by silver electrodeposition. Under pulsed current condition, reasonable agreement is obtained even at the higher pulse current density. It may be ascribed to the fact that pulse electrolysis reduces the nodular growth, edge build up, and surface roughness development.

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Section: Resultssupporting

confidence: 83%

Ionic Mass Transfer Rate Accompanying Pulsed Current Electrodeposition of Silver

Kawai

Fukunaka

Kida

2010

Trans. Mat. Res. Soc. Japan

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“…Since dull and microscopically rough copper electrodeposits are normally produced by DC plating in additivefree plating baths, pulse plating [1][2][3][4][5] and various additives [6][7][8][9][10][11][12] have been used to improve their properties. Among the common additives used for copper electrodeposition in sulphate plating baths is benzotriazole (BTA) [8,[11][12][13][14][15][16][17][18][19][20][21][22][23][24], which is also an effective corrosion inhibitor for copper and its alloys by forming a protective chemisorbed film [25][26][27][28][29][30][31][32][33][34].…”

Section: Introductionmentioning

confidence: 99%

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

Tantavichet

Pritzker

2005

J Appl Electrochem

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DC and pulse plating of copper in acidic sulphate solutions containing benzotriazole (BTA) has been studied. When BTA is the only additive present, it generally has a stronger effect than the plating mode and significantly enhances deposit morphology and surface brightness over that produced in additive-free solutions. XPS and voltammetry analyses indicate that BTA is present at the surface of the deposit, but not through the entire coating, and does not become depleted within the solution over the course of plating. This may help explain why the initial surface smoothness and brightness is maintained as the coating grows beyond 5 lm thick. Plating mode does have a strong effect on deposit morphology under specific conditions. Pulse current plating at low frequency (50 Hz) and low duty cycle (20%) produces deposits with poorer quality than that obtained by DC plating. Pulse reverse plating yields very coarse and dull coatings when the frequency is low enough for metal dissolution to occur during the reverse time. Regardless of the plating mode, the addition of Cl ) eliminates most of the beneficial effects of BTA and leads to very rough and dull deposits. The observed effects are discussed in light of previous research on the electrodeposition and corrosion of the Cu-BTA and Cu-BTA-Cl systems.

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“…His approach can be applied to any form of square pulse, but it is limited to a single reaction. Ibl et al (1978Ibl et al ( , 1980 proposed a simplified pictire of the pulse process by assuming a dynamic inner diffusion layer that pulsates with the frequency of the pulse current density and a stationary outer diffusion layer. He named this model the linear duplex diffusion model.…”

Section: Introductionmentioning

confidence: 99%

A mathematical model of pulse plating on a rotating disk electrode

Yin

White

1990

AIChE Journal

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A galvanostatic pulse plating model is presented for the electrodeposition of an alloy on a rotating disk electrode. This model is used to simulate the electrodeposition of nickel/chrome alloys. The mass transport equations used in the model include the effects of diffusion, migration and convection; and the electrode kinetics are described by the Butler-Volmer equation. It is predicted that the effect of ionic migration is significant and therefore should be included in models of pulse plating.

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Electrocrystallization in pulse electrolysis

Cited by 167 publications

References 6 publications

Ionic Mass Transfer Rate Accompanying Pulsed Current Electrodeposition of Silver

Ionic Mass Transfer Rate Accompanying Pulsed Current Electrodeposition of Silver

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

A mathematical model of pulse plating on a rotating disk electrode

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