Electroconductive textile structures through electroless deposition of polypyrrole and copper at polyaramide surfaces

Investigation of Electrical Stability of Nonwovens with Conductive Circuits Using Printed Conductive Inks

“…This will allow us to determine the overall damage L D of the textile sheet, after each washing test (5, 15 and 25 wash cycles). To this end, use will be made of relation (6), which gives the resistor damage in terms of the instantaneous resistance and the initial resistance of the sample. We have then …”

Synthesis and characterization of copper, polyimide and TIPS-pentacene layers for the development of a solution processed fibrous transistor

“…The reaction mechanism of the polypyrrole layer formation is described in 5 and a study on the optimized chemical's concentrations is as reported in. 6 The reaction proceeded at 4 • C, because at higher temperature too many side-branches are formed disrupting the continuous film formation. At lower temperature, in turn, the reaction speed is too slow.…”

“…At lower temperature, in turn, the reaction speed is too slow. 6 PPy acted as a host material for the deposition of the copper gate layer. Sensitization and activation with a tin-chloride (SnCl 2 ) -palladium-chloride (PdCl 2 ) solution was required.…”

“…Chemisorption of the palladium (Pd) atoms is favoured on the nitrogen-centra (N-centra) in the polypyrrole chains, because of their high affinity for metal. 7 Tin (Sn) was required to initiate palladium (Pd) chemisorption, 6 but had to be removed in an acceleration step using a 1w% hydrochloric acid (HCl) solution during two minutes. Hence, the chemisorbed Pd-centra acting as a catalyst for the copper (Cu) deposition were exposed.…”

“…The copper layer was deposited using electroless plating reduction reaction according to. 6 Copper sulphate and formaldehyde at a respective concentration of 0.04 M and 0.167 M were ideal concentrations for the redox reaction of which the mechanism can be found in Eq. (1).…”