Electrically-pumped compact hybrid silicon microring lasers for optical interconnects

Liang, Di; Fiorentino, Marco; Okumura, Tadashi; Chang, Hsu-Hao; Spencer, Daryl T.; Kuo, Ying-Hao; Fang, Alexander W.; Dai, Daoxin; Beausoleil, Raymond G.; Bowers, John E.

doi:10.1364/oe.17.020355

Cited by 168 publications

(81 citation statements)

References 27 publications

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“…1). Unfortunately, previously demonstrated laser sources have µW to mW thresholds and the best external modulators consume 100 s of fJ to pJ per bit level energies [2][3][4] . Alternative to the standard approach of using a continuous wave laser and external modulator, direct modulation of a fast optical source can drastically reduce the energy consumption for the transmitter.…”

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confidence: 99%

Ultrafast direct modulation of a single-mode photonic crystal nanocavity light-emitting diode

et al. 2011

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Low-power and electrically controlled optical sources are vital for next generation optical interconnect systems to meet strict energy demands. Current optical transmitters consisting of high-threshold lasers plus external modulators consume far too much power to be competitive with future electrical interconnects. Here we demonstrate a directly modulated photonic crystal nanocavity light-emitting diode (LED) with 10 GHz modulation speed and less than 1 fJ per bit energy of operation, which is orders of magnitude lower than previous solutions. The device is electrically controlled and operates at room temperature, while the high modulation speed results from the fast relaxation of the quantum dots used as the active material. By virtue of possessing a small mode volume, our LED is intrinsically single mode and, therefore, useful for communicating information over a single narrowband channel. The demonstrated device is a major step forward in providing practical low-power and integrable sources for on-chip photonics.

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confidence: 99%

Ultrafast direct modulation of a single-mode photonic crystal nanocavity light-emitting diode

et al. 2011

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“…The reported data here is a precondition for high-yield, wafer-scale manufacturing of hybrid silicon evanescent devices. This hybrid silicon process has been used to make the distributed feedback and distributed Bragg reflector lasers [14], mode locked lasers [15] and low threshold ring lasers [16].…”

Section: Resultsmentioning

confidence: 99%

Uniformity study of wafer-scale InP-to-silicon hybrid integration

Liang

Chapman

et al. 2010

Appl. Phys. A

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In this paper we study the uniformity of up to 150 mm in diameter wafer-scale III-V epitaxial transfer to the Si-on-insulator substrate through the O 2 plasma- enhanced low-temperature (300°C) direct wafer bonding. Void-free bonding is demonstrated by the scanning acoustic microscopy with sub-µm resolution. The photoluminescence (PL) map shows less than 1 nm change in average peak wavelength, and even improved peak intensity (4% better) and full width at half maximum (41% better) after 150 mm in diameter epitaxial transfer. Small and uniformly distributed residual strain in all sizes of bonding, which is measured by high-resolution X-ray diffraction Omega2Theta mapping, and employment of a two-period InPInGaAsP superlattice at the bonding interface contributes to the improvement of PL response. Preservation of multiple quantum-well integrity is also verified by high-resolution transmission electron microscopy.

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“…Hydrophilic bonding, adhesion, and hybrid integration techniques for photonic microelectronic fabrication have generated a useful set of active and passive optical components for integration into microelectronic devices [2]. Some of the many photonic structures created include Fabry-Perot cavities [16,19], racetrack rings [20], mode-lock lasers [21], microdisks [22], distributed feedback lasers [23], distributed Bragg reflectors [24], micro-rings [25] lasers, amplifiers [26], PIN [27], metal-semiconductor-metal junctions [28] photodetectors, electroabsorption modulators [29], Mach-Zehnder interferometers [30], micro-disk modulators [31], and high-speed switches [32]. More advanced integration circuits have also been demonstrated [28,33].…”

Section: Integration Of Photonic Components Into Microelectronicsmentioning

confidence: 99%

Electrospinning for nano- to mesoscale photonic structures

et al. 2016

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Abstract:The fabrication of photonic and electronic structures and devices has directed the manufacturing industry for the last 50 years. Currently, the majority of small-scale photonic devices are created by traditional microfabrication techniques that create features by processes such as lithography and electron or ion beam direct writing. Microfabrication techniques are often expensive and slow. In contrast, the use of electrospinning (ES) in the fabrication of microand nano-scale devices for the manipulation of photons and electrons provides a relatively simple and economic viable alternative. ES involves the delivery of a polymer solution to a capillary held at a high voltage relative to the fiber deposition surface. Electrostatic force developed between the collection plate and the polymer promotes fiber deposition onto the collection plate. Issues with ES fabrication exist primarily due to an instability region that exists between the capillary and collection plate and is characterized by chaotic motion of the depositing polymer fiber. Material limitations to ES also exist; not all polymers of interest are amenable to the ES process due to process dependencies on molecular weight and chain entanglement or incompatibility with other polymers and overall process compatibility. Passive and active electronic and photonic fibers fabricated through the ES have great potential for use in light generation and collection in optical and electronic structures/ devices. ES produces fiber devices that can be combined with inorganic, metallic, biological, or organic materials for novel device design. Synergistic material selection and postprocessing techniques are also utilized for broad-ranging applications of organic nanofibers that span from biological to electronic, photovoltaic, or photonic. As the ability to electrospin optically and/or electronically active materials in a controlled manner continues to improve, the complexity and diversity of devices fabricated from this process can be expected to grow rapidly and provide an alternative to traditional resource-intensive fabrication techniques.

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Electrically-pumped compact hybrid silicon microring lasers for optical interconnects

Cited by 168 publications

References 27 publications

Ultrafast direct modulation of a single-mode photonic crystal nanocavity light-emitting diode

Ultrafast direct modulation of a single-mode photonic crystal nanocavity light-emitting diode

Uniformity study of wafer-scale InP-to-silicon hybrid integration

Electrospinning for nano- to mesoscale photonic structures

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