2022
DOI: 10.1007/s12633-022-01935-w
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Electrical Characterization of highly stable 10nm triple-gate FinFET for different contacts and oxide region materials

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Cited by 6 publications
(3 citation statements)
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References 27 publications
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“…Te proposed HSICA is compared with the other transformbased HSICA [16][17][18][19][20][21][22][23] [16] 3D-SPIHT [17] 3D-WBTC [18] 3D-LSK [19] 3D-NLS [20] 3D-LMBTC [21] 3D-LCBTC [22] 3D-ZM-SPECK [23] 3D-LEZSPC 3D-SPIHT [17] 3D-WBTC [18] 3D-LSK [19] 3D-NLS [20] 3D-LMBTC [21] 3D-LCBTC [22] 3D-ZM-SPECK [23] 3D-LEZSPC (f ) Figure 1: PSNR (in db) comparison of 3D-LEZSPC with 3D-SPECK [16], 3D-SPIHT [17], 3D-WBTC [18], 3D-LSK [19], 3D-NLS [20], 3D-LMBTC [21], 3D-LCBTC [22], and 3D-ZM-SPECK [23] at various bit rates for the four diferent hyperspectral images. [32,33]. Te pixel depth (bit depth) of Hyperspectral Image I is 14 bits while the pixel depth of Hyperspectral Image II, II, and IV is 16 bits.…”
Section: Methodsmentioning
confidence: 99%
“…Te proposed HSICA is compared with the other transformbased HSICA [16][17][18][19][20][21][22][23] [16] 3D-SPIHT [17] 3D-WBTC [18] 3D-LSK [19] 3D-NLS [20] 3D-LMBTC [21] 3D-LCBTC [22] 3D-ZM-SPECK [23] 3D-LEZSPC 3D-SPIHT [17] 3D-WBTC [18] 3D-LSK [19] 3D-NLS [20] 3D-LMBTC [21] 3D-LCBTC [22] 3D-ZM-SPECK [23] 3D-LEZSPC (f ) Figure 1: PSNR (in db) comparison of 3D-LEZSPC with 3D-SPECK [16], 3D-SPIHT [17], 3D-WBTC [18], 3D-LSK [19], 3D-NLS [20], 3D-LMBTC [21], 3D-LCBTC [22], and 3D-ZM-SPECK [23] at various bit rates for the four diferent hyperspectral images. [32,33]. Te pixel depth (bit depth) of Hyperspectral Image I is 14 bits while the pixel depth of Hyperspectral Image II, II, and IV is 16 bits.…”
Section: Methodsmentioning
confidence: 99%
“…Static random access memory (SRAM) is used as CPU cache memory, occupying over half of the System-on-Chip (SoC) die area. The high density of SRAM with nanosized transistors is vulnerable to variability due to process variations and short-channel effects such as drain-induced barrier lowering (DIBL), non-ideal subthreshold swing ( SS ), and threshold voltage (V th ) roll-off [ 1 , 2 , 3 , 4 ]. The fin field-effect transistor (FinFET)-based SRAM has been adopted to overcome the problems of planar SRAM [ 5 ].…”
Section: Introductionmentioning
confidence: 99%
“…Power consumption is the most significant challenge to continue MOSFET scaling because of physical limitations to scale subthreshold swing (SS) below 60 mV/decade at 300 K [1][2][3]. Even with FinFET [4][5][6][7] or double-gate MOSFETs, SS is larger than 60 mV/decade. To overcome this limit, many super steep switching devices have been proposed, such as negative capacitance field effect transistors (FETs) [8], nanoelectromechanical [9] switches with the mechanical operation of the channel, phase FET [10,11], and tunnel FETs [12,13].…”
Section: Introductionmentioning
confidence: 99%