Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys

El-Daly, A.A.; Hammad, A.E.

doi:10.1016/j.jallcom.2010.06.142

Cited by 70 publications

(67 citation statements)

References 24 publications

(44 reference statements)

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“…This finding is surprising, because only one peak was found during melting in all cases. However, double peaks are often presented in the literature 23,24 and are assigned to the noneutectic behavior of the studied Sn-based systems. Figures 3 and 4 show DSC results where the solder behaves as a eutectic alloy even when connected to a PCB with various surface finishes (Sn can be consumed or enters the liquid from the surface finish).…”

Section: Study Ofmentioning

confidence: 99%

Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints

Rudajevová

Dusek

2014

Journal of Elec Materi

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Undercooling and recalescence were studied using the differential scanning calorimetry (DSC) method on real electronic systems. Two solder pastes, Sn 62.5 Pb 36.5 Ag 1 and Sn 96.5 Ag 3 Cu 0.5 , were used for preparation of electronic joints. Various combinations of these solders and soldering pads with different surface finishes such as Cu, Cu-Ni-Au, Cu-Sn, and Cu-Sn 99 Cu 1 were used. During melting of both pastes, the Sn and Sn 99 Cu 1 surface finishes immediately dissolved in the solder and the Cu surface coating was exposed to the melt. Therefore, practically the same undercooling was found for the Cu, Cu-Sn, and Cu-Sn 99 Cu 1 coatings. The lowest undercooling was found for the Cu-Ni-Au surface finish for both solder pastes. If two separated electronic joints were made on the sample, two separate peaks were found in the DSC signal during solidification. In the sample with only one joint, only one exothermic peak was found. These findings were observed for all paste/surface finish combinations. These data were analyzed, showing that this effect is a consequence of undercooling and recalescence: Latent heat released during solidification of the joint increases the surrounding temperature and influences all the processes taking place.

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Section: Study Ofmentioning

confidence: 99%

Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints

Rudajevová

Dusek

2014

Journal of Elec Materi

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“…Low melting points, suitable mechanical properties, and relatively low costs characterize the Sn-Zn alloys [5][6][7][8] , when compared with others lead-free solder alloys. However, the eutectic Sn-9wt.%Zn alloy has displayed drawbacks as poor wettability and oxidation phenomenon.…”

Section: Introductionmentioning

confidence: 99%

“…However, the eutectic Sn-9wt.%Zn alloy has displayed drawbacks as poor wettability and oxidation phenomenon. The addition of alloying elements, such as Ag, Cu, Bi improved such characteristics as well as mechanical properties [5][6][7][8] . It is known that the microstructural features (formation of phases, intermetallics, morphology, distribution and length-scale) may be affected by cooling thermal parameters during process (growth rate-V and cooling rate-Ṫ) 9,10 .…”

Section: Introductionmentioning

confidence: 99%

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Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

Silva

Spinelli

2018

Mat. Res.

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The microstructure length-scales (dendritic and eutectic), morphologies and tensile properties of a ternary Sn-9wt.%Zn-2wt.%Cu alloy are compared with those of a binary eutectic Sn-9wt.%Zn alloy. The following experimental/analytical steps were performed: transient directional solidification experiments of the Sn-9wt.%Zn-2wt.%Cu alloy; measurements of secondary dendrite arm (λ 2 ) and interphase spacing (λ); morphology of the eutectic α-Zn phase; determination of thermal parameters such as cooling rate (Ṫ L ) and their evolutions during solidification; and, finally, interrelations of microstructure vs. tensile properties. The addition of 2wt.%Cu causes significant refinement of the eutectic structure. Hall-Petch type experimental expressions outlined the variations of strength and ductility with both λ 2 and λ. Very fine Zn globules and needles forming the eutectic in the ternary alloy seems to cause a reversal on ductility behavior, as compared to the tendency observed for the binary Sn-9wt.%Zn alloy. Here, for the ternary Sn-9wt.%Zn-2wt.%Cu alloy ductility increases with decreasing interphase spacing.

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“…The Sn-9Zn alloy, the most preferred soldering alloy in recent years, stands out with its aspects such as having a melting temperature (198.5 • C) close to traditional Sn37Pb alloy, low cost, good mechanical properties, and not causing any damage to human health and environment [13][14][15][16][17]. However, the alloy has low wettability and corrosion resistance due to easy oxidation of Zn, which is an active element [18][19][20][21]. For this reason, third and fourth alloy elements must be added to the Sn-Zn soldering alloy in order to increase use of alloy systems [22][23][24][25].…”

Section: Introductionmentioning

confidence: 99%

An Investigation of Microstructure and Mechanical Properties of Sn-9Zn-xCr Alloys Produced by Investment Casting Method

Yavuzer

Özyürek

2017

Acta Phys. Pol. A

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In this study, the microstructure and mechanical properties were investigated of different amount Cr (0.1%, 0.5%, 0.9%) added Sn-9Zn eutectic alloys and Weibull statistical analyses were evaluated using ultimate tensile strength. Pure elements (Sn, Zn, Cr) were used for production of alloys and pre-alloying was done and waited in the electrical resistance furnace at 450 • C for 1 h to homogenized and poured as ingot in plaster moulds. Then pre-alloyed Sn-9Zn-xCr ingots were melted and poured at 300 • C in ceramic moulds prepared investment casting method. As a result of the study, the highest hardness and ultimate tensile strength values were measured in the Sn-9Zn alloy with 0.1% Cr. It was determined that while ultimate tensile strength was decreased, percentage of elongation was increased by increase of Cr amount. According to the Weibull statistical analyses results, the highest Weibull module was calculated by Sn-9Zn-0.1Cr alloy ultimate tensile strength values.

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Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys

Cited by 70 publications

References 24 publications

Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints

Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints

Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

An Investigation of Microstructure and Mechanical Properties of Sn-9Zn-xCr Alloys Produced by Investment Casting Method

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