Efficient VIA position optimization for yield enhancement

Liu, Hsi Min; Tseng, Yen Po; Lee, Chia Chien; Tsai, Chun-Sheng; Fang, Xiang; Ma, Shouyuan; Liao, Hung-Yueh; Lin, Ling-Chieh; Pearson, Alexander T.; Khanna, Manish

doi:10.1117/12.2597680

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2023

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“…Another crucial aspect to consider when dealing with more aggressive nodes is the vertical interconnect pathways (Via) to metal enclosures. Presently, the via-to-metal enclosure connection has emerged as a significant bottleneck in achieving yield enhancement [2]. Optical proximity correction (OPC) consistently employs selective sizing for metal in order to provide adequate via enclosure, thereby mitigating issues related to poor metal coverage and misalignment introduced by process variations [3].…”

Section: Introductionmentioning

confidence: 99%