MRS Proc. 1998 DOI: 10.1557/proc-515-3 View full text
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C. F Shih, W. T. Chen, B. Cotterell, S. K. Lahiri, Y.W. Zhang

Abstract: ABSTRACTOne of the most important mechanical features in microelectronic packaging is the nterface. Recent developments in modelling interfacial fracture and the easurement of interfacial toughness relevant to microelectronic packaging are discussed.