Effects of triethylamine on the imidization temperature and properties of PI adhesive

Wei, Mengling; Li, Duxin; Xiao, Chunguang; Pan, Donghua

doi:10.1088/2053-1591/aaee4d

Cited by 5 publications

(2 citation statements)

References 21 publications

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“…Moreover, if the majority of amide groups on the PAA chain are cured with EP at a relatively low temperature, then there are fewer amide groups left for imidization to form PI, and the expected superior thermally stable PI-EP copolymer matrix will not be obtained. Previous studies [ 17 , 18 , 19 , 20 , 27 , 28 , 29 , 30 ] reported that the PI-EP copolymer matrix could be obtained as expected, and benefits from both PI and EP have been observed. There must be some critical points worth noticing in the process of copolymerization.…”

Section: Introductionsupporting

confidence: 62%

“…Using PAA with different terminal functional groups could be a feasible way [ 26 ]. Xing et al and others [ 27 , 28 ] used waterborne PI to modified waterborne EP resin by neutralizing the precursor (PAA) with 2-methylimidazol for PAA salt (PAAS) formation, after which the salt is basically waterborne. Accordingly, they found the copolymerized PAAS and EP copolymer with a semi-interpenetrating structure.…”

Section: Introductionmentioning

confidence: 99%

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Interpenetration Networked Polyimide–Epoxy Copolymer under Kinetic and Thermodynamic Control for Anticorrosion Coating

Chen

Whang

et al. 2023

Polymers

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Epoxy (EP) was copolymerized with polyamic acid (PAA, precursor of polyimide (PI)) with termanil monomers of (1) 4,4′-Oxydianiline (ODA) and (2) pyromellitic dianhydride (PMDA) individually to form (PI-O-EP) and (PI-P-EP) copolymers. The FTIR spectrum of PI-O-EP copolymerization intermediates shows that some amide-EP linkages were formed at low temperature and were broken at higher temperature; in additoin, the released amide was available for subsequent imidization to form PI. The curing and imidization of the amide groups on PAA were determined by reaction temperature (kinetic vs. thermodynamic control). In PI-P-EP, the released amide group was very short-lived (fast imidization) and was not observed on FTIR spectra. Formation and breakage of the amide-EP linkages is the key step for EP homopolymerization and formation of the interpenetration network. PI contributed in improving thermal durability and mechanical strength without compromising EP’s adhesion strength. Microphase separations were minimal at PI content less than 10 wt%. The copolymerization reaction in this study followed the “kinetic vs. thermodynamic control” principle. The copolymer has high potential for application in the field of higher-temperature anticorrosion.

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Section: Introductionsupporting

confidence: 62%

Section: Introductionmentioning

confidence: 99%

Interpenetration Networked Polyimide–Epoxy Copolymer under Kinetic and Thermodynamic Control for Anticorrosion Coating

Chen

Whang

et al. 2023

Polymers

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Chemically imidized semi-alicyclic polyimides: the effect of catalyst type and imidization temperature

Šimonová,

Machotová,

Zelenka

et al. 2023

J Mater Sci

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Polyimides are a group of polymers with excellent thermal and mechanical properties. However, generally, they exhibit brown coloration due to charge transfer interactions between diamine donor and dianhydride acceptor moieties. In this study, semi-alicyclic polyimides derived from cyclohexane tetracarboxylic dianhydride and 4,4′-oxydianiline were prepared using a two-step method, where the imidization step proceeded via a chemical route. The effects of the catalyst type (quinoline, triethylamine, and 1,4-diazabicyclo(2.2.2)octane (DABCO)) and reaction temperature (120, 140, and 160 °C) on the imidization process were evaluated using infrared spectroscopy and nuclear magnetic resonance spectroscopy. The prepared polyimides' thermal, mechanical, and optical properties were compared with those synthesized via standard thermal imidization. Polyimide films possessing favorable mechanical properties, thermal stability, and good optical transparency were prepared via a simple preparation route based on chemical imidization using the triethylamine catalyst at the reaction temperature of 160 °C, which was shown to be a promising way for the PI preparation on an industrial scale. Graphical abstract

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Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole

Sui

Wang

et al. 2021

Polymer

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Effects of triethylamine on the imidization temperature and properties of PI adhesive

Cited by 5 publications

References 21 publications

Interpenetration Networked Polyimide–Epoxy Copolymer under Kinetic and Thermodynamic Control for Anticorrosion Coating

Interpenetration Networked Polyimide–Epoxy Copolymer under Kinetic and Thermodynamic Control for Anticorrosion Coating

Chemically imidized semi-alicyclic polyimides: the effect of catalyst type and imidization temperature

Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole

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