Effects of Surfactants on High Regularity of 3D Porous Nickel for Zn²⁺ Adsorption Application

Abstract

Three-dimensional porous nickel (3D-PN) film with large specific surface area (As) and high porosity has been successfully prepared by hydrogen bubble dynamic template (HBDT) method. This work presents the effects of PEG 10000 and 1,4-butynediol as new additive combination on surface morphology of the PN film. Meanwhile, the application of 3D-PN in Zn2+adsorption was preliminarily investigated in the paper. The surface area is determined as large as 166.7 cm2/mg and the porosity is 0.762 when the concentration of PEG 10000 and 1,4-butynediol was 0.3 g/100 mL and 0.1 g/100 mL, respectively. The adsorption capacity (QtandQ(%)) of PN for Zn2+is observed to be 9.145 mg/g and 0.691 for Zn(NO3)2·6H2O. The morphology and the microstructure, the product formation, theAsthe concentration of the metal ions were characterized by scanning electron microscopy (SEM), X-ray powder diffraction (XRD), electrochemical impedance spectroscopy (EIS), and atomic absorption spectrometry (AAS), respectively.

Controlling Selectivity in the Electrocatalytic Hydrogenation of Adiponitrile through Electrolyte Design

“…Raney nickel electrodes were electrodeposited from an electrolyte containing 4 g of aluminum nickel (AlNi) catalyst dispersed in a 50 mL aqueous solution of 0.8 M nickel­(II) sulfate, 0.3 M ammonium chloride, and 0.2 M boric acid, as reported in the literature. , A nickel foil was pretreated for 5 min in 8 M sodium hydroxide and for 5 min in 1 M hydrochloric acid in order to remove the impurities from the electrode surface. The electrolyte solution was vigorously stirred (at 1200 rpm with a 1 cm long stirring bar) to maintain the AlNi particles suspended in the solution.…”

The Effect of Surfactant Content over Cu-Ni Coatings Electroplated by the sc-CO2 Technique

“…Consequently, Ni was co-plated with Cu. Additionally, as a type of gemini surfactant, 1,4-butynediol, with an ideal solution interface adsorption capacity, can depress rapid accumulation of H + and simultaneously promote the migration rate of H + from the cathode to the solution interface [ 10 ].…”