“…In addition, the deposited oxide layer can also serve as surface passivation to relieve the problems of Fermi level pinning under the gate electrode and to reduce RF current collapse [4,5]. A variety of oxide materials have been applied to the MOS-gate structure such as Si 3 N 4 [6,7], SiO 2 [8,9], HfO 2 [10][11][12], ZrO 2 [11,12], La 2 O 3 [13,14], TiO 2 [15], Er 2 O 3 [16], and Al 2 O 3 [17][18][19][20][21][22][23]. Among them, Al 2 O 3 has advantages of high relative permittivity (k ∼ 10), good thermal stability (amorphous up to 1000 °C), high breakdown field (>5 MV cm −1 ), and wide band-gap (9 eV).…”