Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate

Hu, Xiaowu; Xu, Tao; Jiang, Xiongxin; Li, Yulong; Liu, Yi; Min, Zhixian

doi:10.1007/s00339-016-9893-1

Cited by 30 publications

(12 citation statements)

References 21 publications

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“…Hu et al have found the similar phenomenon and concluded that the slow cooling rate would lead to more Cu atoms which could diffuse toward to Cu 6 Sn 5 to form Cu 3 Sn phase within a sufficient time. And this transformation could be summarized as the below formula [33]:…”

Section: Resultsmentioning

confidence: 99%

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Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Cheng

et al. 2020

Appl. Phys. A

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In the current investigation, various mass fractions (0, 0.5, 1.5, 5 and 10 wt%) of Ni were doped into Cu substrate, and influences of Ni addition on the microstructure evolution and mechanical property of the Sn-58Bi/Cu-xNi solder joint were investigated. Results showed that the growth rate of intermetallic compound (IMC) would increase with the Ni addition added from 0 to 5 wt% and remarkably decreased for Sn-58Bi/Cu-10Ni joint system. It indicated that the growth rate of IMC layer would decrease when 10 wt% Ni was added into the alloy. Besides, the tensile strength reduced with increase in the IMC thickness, which was under the synergistic effect of increasing liquid-state reaction time and the content of Ni addition (0-5 wt%). Moreover, the fracture mechanism gradually transformed from ductile fracture mode to brittle fracture mode with the decrease in joint strength.

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Section: Resultsmentioning

confidence: 99%

“…Generally, the intrinsic function of the IMC growth could be implemented by the following empirical formula [33]:…”

Section: Resultsmentioning

confidence: 99%

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Cheng

et al. 2020

Appl. Phys. A

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“…Therefore, the growth of the Cu 6 Sn 5 IMC layer was significantly decreased, resulting in a thinner IMC layer [Figures 8(c) and 8(d)]. It is also possible that the formation of the Cu 6 Sn 5 IMC layer in the quenched solder joints occurred only during the reflow process (because Cu still diffused into the solder alloy) (Hu et al, 2016).…”

Section: Mechanism Of Intermetallic Formation Under Different Cooling Conditionsmentioning

confidence: 99%

Selective etching and hardness properties of quenched SAC305 solder joints

Yahaya

Salleh

Kheawhom

et al. 2020

SSMT

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Purpose The purpose of this paper is to investigate the morphology of intermetallic (IMC) compounds and the mechanical properties of SAC305 solder alloy under different cooling conditions. Design/methodology/approach SAC305 solder joints were prepared under different cooling conditions/rates. The performance of three different etching methods was investigated: simple chemical etching, deep etching based on the Jackson method and selective removal of β-Sn by a standard three-electrode cell method. Phase and structural analyses were conducted by X-ray diffraction (XRD). The morphology of etched solder was examined by a field emission scanning electron microscope. The hardness evaluations of the solder joints were conducted by a Vickers microhardness tester. Findings The Ag3Sn network was significantly refined by the ice-quenching process. Further, the thickness of the Cu6Sn5 layer decreased with an increase in the cooling rate. The finer Ag3Sn network and the thinner Cu6Sn5 IMC layer were the results of the reduced solidification time. The ice-quenched solder joints showed the highest hardness values because of the refinement of the Ag3Sn and Cu6Sn5 phases. Originality/value The reduction in the XRD peak intensities showed the influence of the cooling condition on the formation of the different phases. The micrographs prepared by electrochemical etching revealed better observations regarding the shape and texture of the IMC phases than those prepared by the conventional etching method. The lower grain orientation sensitivity of the electrochemical etching method (unlike chemical etching) significantly improved the micrographs and enabled accurate observation of IMC phases.

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“…Dalam kajian ini, terdapat dua jenis lapisan IMC yang dicerap , lapisan bawah yang lebih gelap dan lapisan atas yang lebih cerah. Kedua-dua lapisan yang dicerap ini adalah selaras dengan kajian lepas yang menggunakan bahan pateri yang sama, SAC305 dan substrat Cu (Hu et al 2016). Lapisan tersebut direkodkan sebagai Cu 3 Sn bagi lapisan bawah yang gelap dan Cu 6 Sn 5 bagi lapisan atas yang cerah.…”

Section: Keputusan Dan Perbincanganunclassified

Kesan Pigmen Pewarna terhadap Pertumbuhan Sebatian antara Logam Sambungan Pateri Sn-3.0Ag-0.5Cu

Jalar¹,

Bakar

Ismail

et al. 2018

JSM

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Pewarnaan pes pateri membuka suatu ruang kepada keperluan dalam teknologi untuk proses pengenalpastian, penandaan, piawaian, pengujian dan penilaian terhadap antarasambungan pes pateri. Dua jenis pigmen pewarna iaitu hijau (G) dan bercahaya dalam gelap (GD) digunakan untuk mengkaji kesan pewarnaan sambungan pateri ke atas kestabilan antarasambungan pateri Sn-3.0Ag-0.5Cu (SAC 305). Pes pateri tanpa warna digunakan sebagai sampel kawalan untuk membandingkan keputusan kajian. Uji kaji penuaan sesuhu digunakan untuk melihat perubahan pertumbuhan sebatian antara logam (IMC). Pigmen pewarna GD dengan peratusan sebanyak 5% telah menunjukkan kestabilan pertumbuhan IMC dengan perubahan pertumbuhan yang paling rendah iaitu sebanyak 5.6 µm bagi sambungan pateri yang berwarna berbanding dengan peratusan pigmen pewarna yang lebih tinggi dengan perubahan pertumbuhan IMC sehingga 9 µm selepas didedahkan kepada penuaan sesuhu pada 150°C selama 1000 jam. Walau bagaimanapun, kestabilan pertumbuhan IMC dengan penggunaan pes pateri berwarna adalah lebih rendah berbanding dengan pes pateri tidak berwarna. Maka penambahan pigmen pewarna hendaklah dipertimbangkan dengan mengambil kira kestabilan mikrostruktur dan pertumbuhan lapisan IMC supaya tidak menjejaskan kualiti dan kebolehharapan sesuatu sambungan pateri.

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Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate

Cited by 30 publications

References 21 publications

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Selective etching and hardness properties of quenched SAC305 solder joints

Kesan Pigmen Pewarna terhadap Pertumbuhan Sebatian antara Logam Sambungan Pateri Sn-3.0Ag-0.5Cu

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