2007
DOI: 10.1016/j.eurpolymj.2006.10.016
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Effects of organophilic montmorillonite on hydrogen bonding, free volume and glass transition temperature of epoxy resin/polyurethane interpenetrating polymer networks

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Cited by 71 publications
(17 citation statements)
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“…The dual-sized carbon fiber surface became smooth because the surface was coated with the secondary sizing layer. It may be expected that strong hydrogen bonds formed between epoxy and PU [ 42 ] contributed to binding the filaments together during dual-sizing process. The additionally sized surface was clearly found in both dual-sized carbon fiber cases.…”
Section: Resultsmentioning
confidence: 99%
“…The dual-sized carbon fiber surface became smooth because the surface was coated with the secondary sizing layer. It may be expected that strong hydrogen bonds formed between epoxy and PU [ 42 ] contributed to binding the filaments together during dual-sizing process. The additionally sized surface was clearly found in both dual-sized carbon fiber cases.…”
Section: Resultsmentioning
confidence: 99%
“…41 When the weight ratio of FMWCNTs reached to 20%, the T g increased from 82.5°C to 117.7°C. The change of T g suggested the hydrogen bonding interaction between PAI/POMA and FMWCNTs was strengthened, 55 which could improve the dispersion of conductive fillers into the polymer matrix, as discussed below.…”
Section: Resultsmentioning
confidence: 98%
“…T g is a significant parameter for the thermoset epoxy resins, and in most applications, the working temperature of epoxy-based materials is below their T g . 20,21 The glass transition of cured EP and BEP was determined by DSC. The DSC curves of all the cured samples are shown in Figure 3, and the T g of each cured sample is marked in Figure 3.…”
Section: Dsc Analysismentioning
confidence: 99%