Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate

Sn–0.7 wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

“…Among several lead-free solder series, alloys from the SnCu-xNi system have emerged as the most promising alternatives for applications in electronic devices, mainly in compositions varying from 0.5 to 1.0 wt%Cu and from 0 to 0.1 wt%Ni. It is known that the microstructure, mechanical properties, thermal and electric resistance and wettability of the Sn-0.7 wt%Cu eutectic alloy solidified against a copper substrate can be altered by the addition of small quantities of certain alloying elements, such as nickel, and by solidification conditions (cooling rate, growth rate, segregation) [3][4][5][6][7][8].…”

Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In

“…Great achievement has been focused on developing the overall wetting and soldering properties of Sn-Cu solder and progress has been made by adding different alloying elements, such as Ag, In, Zn, and Ni [3,[8][9][10]. The presence of the second phase has been shown to trigger the microstructural mechanism that enhances the reliability of the solder joints.…”

“…The presence of the second phase has been shown to trigger the microstructural mechanism that enhances the reliability of the solder joints. Recently, Wang and Shen [9] revealed that a small amount of Ni addition to the Sn-Cu solder could effectively improve the solder properties, such as the mechanical strength and wettability. The Ni particles mostly leaded to modify microstructural features and to improve the interfacial reactions between Ni and the Sn-Cu solders.…”

Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C

“…4,5 The lead-free solders often join with Ni, which is a common barrier layer material due to its lower reaction rates and ability to prevent solders from having a fast reaction with Cu. 6,7 Some related studies have been performed on these interfacial systems to comprehensively evaluate the reliability of solder joints during the soldering process and product usage. [8][9][10] In soldering, intermetallic compound (IMC) formation can assist with bonding the solder alloy to the substrate.…”