Effects of multiple reflows on interfacial reaction and shear strength of SnAgCu and SnPb solder joints with different PCB surface finishes

Liu, Ping; Yao, Pei; Liu, Jim

doi:10.1016/j.jallcom.2008.02.102

Cited by 77 publications

(43 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Since the solders used in electronic packaging field serve not only to provide the electronic connection but also to ensure the mechanical reliability of solder joints under the service conditions [1], it has been recognized that one of the major concerns for the integrity of the solder interconnection is the strength and damage mechanisms at the solder/substrate interfaces under various practical service conditions. In recent years, there have been many investigations on various series of lead-free solder joints from this viewpoint [2][3][4][5][6][7][8], while tensile behaviors of as-soldered and isothermal aged solder joints were widely investigated. It has been reported that tensile strength of the Cu/lead-free solder joints decreased with increasing interfacial IMC thickness in principle and crack usually occurred at the Cu/solder interface [2][3][4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Fracture mechanism and strength-influencing factors of Cu/Sn–4Ag solder joints aged for different times

Zhang

2009

Journal of Alloys and Compounds

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 99%

Fracture mechanism and strength-influencing factors of Cu/Sn–4Ag solder joints aged for different times

Zhang

2009

Journal of Alloys and Compounds

View full text Add to dashboard Cite

“…Surface finish used can also change the morphology of the IMC formed [17,18]. Tseng and Duh [19] investigated the interfacial reaction of Sn-3.0Ag-0.5Cu solder jointed with ENIG and electroless Ni-P/electroless Pd/immersion Au (ENEPIG).…”

Section: Interfacial Reaction Of Solder Alloy and Surface Finishmentioning

confidence: 99%

A review on the effect of surface finish and cooling rate on solder joint reliability

Kahar¹,

Akhtar²,

Idris³

et al. 2016

WIT Transactions on the Built Environment

View full text Add to dashboard Cite

With increasing environmental concern over the toxicity of lead (Pb) combined with strict regulations, the use of lead-based solders provides an inevitable driving force for the development of lead-free solder alloys. Many studies have been conducted for the evaluation of the solder joint reliability with respect to solder alloys and surface finishes. However, as the demand of electronic devices is increasing, there is a need to improve the mechanical properties of the solder joint in order to keep up with the current evolution of electronic devices' technology. In this study, the effect of surface finish and cooling rate on solder joint reliability using nickel-based surface finish was summarized. The study focused on nickel based surface finish (ENIG and ENEPIG) with different cooling media, slow (furnace), medium (air) and fast (water). It was found that the type of surface finish and the cooling rate can change the morphology of the solder intermetallic compound (IMC) and directly changes the solder joint mechanical properties. A faster cooling rate was reported to provide finer IMC grains which might be translated into better solder joint strength. The findings presented here may provide a better understanding for further study and facilitate improvements in terms of solder joint reliability.

show abstract

“…Other heating cycles can be present in manufacturing such as additional solder rework [3]. One challenge associated with current generation Pb-free solder alloys is that during multiple thermal cycles, the joint strength may degrade due to the rapid growth of the interfacial layer of intermetallic compounds [4][5][6][7][8][9][10][11][12]. In a typical Pb-free solder joint, Cu6Sn5, which may form either as primary crystals or an interfacial layer during soldering can play a determining role in solder joint strength.…”

Section: Introductionmentioning

confidence: 99%

Suppression of Cu 6 Sn 5 in TiO 2 reinforced solder joints after multiple reflow cycles

et al. 2016

View full text Add to dashboard Cite

In the current generation of 3D electronic packaging, multiple reflows are often required during soldering. In addition, electronic packages may be subjected to additional solder rework or other heating processes. This paper investigates the effects of multiple reflow cycles on TiO2 reinforced Sn-0.7Cu solder fabricated by a powder metallurgy microwave sintering technique.Compared to TiO2-free equivalents, a relative suppression of the Cu6Sn5 phase, both as primary crystals and as an interfacial layer was observed. The likely mechanism relates to the TiO2 nanoparticles promoting nucleation and decreasing the amount of time that liquid is in contact with the interfacial layer. The TiO2 particles appear to stabilise the interfacial Cu6Sn5 layer and result in a more planar morphology. The suppression of Cu6Sn5 results in TiO2 reinforced solder joints having a higher shear strength after multiple reflow cycles compared to Sn-0.7Cu solder joints. IntroductionSolder alloys play a crucial role in determining performance and reliability in the assembly and interconnection of electronic products and have electrical, thermal and mechanical functions [1,2]. The relative importance of solder alloy properties has increased due to continued miniaturization of microelectronic circuitry and the use of finer pitch interconnects. Higher functional densities in printed circuit boards (PCB) have been made possible by surface mount technology (SMT) using reflow soldering, often with multiple reflow cycles. Other heating cycles can be present in manufacturing such as additional solder rework [3]. One challenge associated with current generation Pb-free solder alloys is that during multiple thermal cycles, the joint strength may degrade due to the rapid growth of the interfacial layer of intermetallic compounds [4][5][6][7][8][9][10][11][12]. In a typical Pb-free solder joint, Cu6Sn5, which may form either as primary crystals or an interfacial layer during soldering can play a determining role in solder joint strength. There is evidence that by suppressing the Cu6Sn5 interfacial layer, solder joint properties could be improved [13][14][15][16][17] and as such there are benefits associated with controlling the growth of this layer during multiple reflows.It has recently been reported that additions of reinforcement to a variety of solder matrices, with compounds including silicon carbide (SiC) [18][19][20], nickel oxide (NiO) [21], alumina (Al2O3) [22][23][24], zirconia (ZrO2) [25][26][27][28], titanium oxide (TiO2) [29][30][31][32][33][34] and silicon nitride (Si3N4) [35,36] result in suppression of the growth of the interfacial layer during soldering [37]. In our recent study [38], we developed a method of fabricating a reinforced solder using a powder metallurgy microwave sintering method that results in a homogeneous distribution of TiO2 in the solder material and an improvement in the bulk solder material thermal and mechanical properties. However, properties related to the solder joint strength after multiple reflows of t...

show abstract

Effects of multiple reflows on interfacial reaction and shear strength of SnAgCu and SnPb solder joints with different PCB surface finishes

Cited by 77 publications

References 11 publications

Fracture mechanism and strength-influencing factors of Cu/Sn–4Ag solder joints aged for different times

Fracture mechanism and strength-influencing factors of Cu/Sn–4Ag solder joints aged for different times

A review on the effect of surface finish and cooling rate on solder joint reliability

Suppression of Cu 6 Sn 5 in TiO 2 reinforced solder joints after multiple reflow cycles

Contact Info

Product

Resources

About