2013
DOI: 10.2320/matertrans.m2013110
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Effects of Electrical Current on Microstructure and Interface Properties of Sn–Ag–Cu/Ag Photovoltaic Ribbons

Abstract: This study presents an electrical current testing that is based on the SnxAg0.5Cu (x = 1, 3 mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (¢-Sn+Cu 6 Sn 5 +Ag 3 Sn) and the base phases (¢-Sn). The eutectic phases in the Sn3Ag0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu 6 Sn 5 and Ag 3 Sn IMCs were found at the interf… Show more

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Cited by 4 publications
(2 citation statements)
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References 17 publications
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“…Among lead-free solders, Sn-Ag-Cu (SAC) alloy has good wettability and mechanical properties, making it suitable for solar cell interconnections [3]- [5]. The feasibility of using SAC solders in solar applications was reported in our previous studies [6], [7]. However, there is still room for improvement in SAC PV ribbon.…”
Section: Introductionmentioning
confidence: 99%
“…Among lead-free solders, Sn-Ag-Cu (SAC) alloy has good wettability and mechanical properties, making it suitable for solar cell interconnections [3]- [5]. The feasibility of using SAC solders in solar applications was reported in our previous studies [6], [7]. However, there is still room for improvement in SAC PV ribbon.…”
Section: Introductionmentioning
confidence: 99%
“…fim de reduzir gastos com prata para conectar as células entre si, os fabricantes optam por utilizar busbars, fitas compostas de metais de menor valor[43], normalmente de cobre cobertas por estanho e chumbo[35]. A prata está presente nos pontos de soldagem do busbar, em alguns casos[47,48].Os módulos fotovoltaicos sofrem uma diminuição de eficiência ao longo dos anos, possuindo um tempo de vida entre 20 e 30 anos. Esse tempo de vida corresponde à queda de eficiência para 80% do valor nominal instalado[55].…”
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