“…It is considered that the microstructure, grain size and grain boundary will all play certain roles in the leakage current behavior. The films with larger grain size and more aligned grain configurations have overall shorter conduction paths along the grain boundaries, which causes an increase in the leakage [10]. Meanwhile, as had been obtained that the BTO film deposited on Pt/Ti/Si exhibit a rather coarser surface, thus the interfacial charge accumulation at the film/electrode interface is unavoidable, which may scatter further the injected carriers, thus reducing their mobility, and may trap the carriers, thus decreasing their density [34].…”