Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond

Guo, Chucai; Sun, Fangyuan; Duan, Jialiang; Che, Zifan; Wang, Xitao; Wang, Jinguo; Kim, Moon J.; Zhang, Hailong

doi:10.1016/j.actamat.2018.09.004

Cited by 123 publications

(55 citation statements)

References 51 publications

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“…This is an indirect method to verify the effectiveness of the AMM model. In another work [87], authors directly compared the prediction values by AMM to the experimentally measured TBC value by TDTR technique (which will be introduced later), and it clearly shows the discrepancy between the predicted and experimental values. This means the assumptions in AMM theory need to be further refined.…”

Section: Thermal Boundary Conductancementioning

confidence: 99%

“…TDTR technique is just applied for investigating the interface thermal conductance problem of copper/diamond composites recently [80,87,110]. The general principle is that the interface scenario in the copper/diamond composites can be physically simulated through creating a Ti layer by magnetron sputtering onto a diamond substrate, as shown in Fig.…”

Section: Figure 25mentioning

confidence: 99%

“…According to the assumptions in DMM and AMM, the phonons of the material that is sitting on one side of the interface layer can only couple with the phonons that have identical frequency from the material sit on the other side of the interface layer during transmission process. Large interface vibrational mismatch of the materials on the two sides leads to that very few Figure 28 Schematic diagram of key components of a TDTR system [87]. Figure 29 Thermal boundary conductance at the GaSb/GaAs interfaces with two different dislocations density from the work [111].…”

Section: Thermal Conductance Of the Interface Layermentioning

confidence: 99%

“…The meanings of symbols in these equations are the same as those in Maxwell and H-J models. Due to its concise form and simplicity, the DEM model is applied in many works related to copper/diamond composite materials [6,7,19,87,127]. Yang et al find that the Cu/diamond composite with Ti additive can reach 99% of the predicted value (555 W/m K) by the DEM model [62].…”

Section: Differential Effective Medium (Dem) Modelmentioning

confidence: 99%

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High thermal conductive copper/diamond composites: state of the art

Jia

Yang

2020

J Mater Sci

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Copper/diamond composites have drawn lots of attention in the last few decades, due to its potential high thermal conductivity and promising applications in high-power electronic devices. However, the bottlenecks for their practical application are high manufacturing/machining cost and uncontrollable thermal performance affected by the interface characteristics, and the interface thermal conductance mechanisms are still unclear. In this paper, we reviewed the recent research works carried out on this topic, and this primarily includes (1) evaluating the commonly acknowledged principles for acquiring high thermal conductivity of copper/diamond composites that are produced by different processing methods; (2) addressing the factors that influence the thermal conductivity of copper/diamond composites; and (3) elaborating the interface thermal conductance problem to increase the understanding of thermal transferring mechanisms in the boundary area and provide necessary guidance for future designing the composite interface structure. The links between the composite’s interface thermal conductance and thermal conductivity, which are built quantitatively via the developed models, were also reviewed in the last part.

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Section: Thermal Boundary Conductancementioning

confidence: 99%

Section: Figure 25mentioning

confidence: 99%

Section: Thermal Conductance Of the Interface Layermentioning

confidence: 99%

Section: Differential Effective Medium (Dem) Modelmentioning

confidence: 99%

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High thermal conductive copper/diamond composites: state of the art

Jia

Yang

2020

J Mater Sci

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“…In the molten salt process, the C atoms from the GF surface firstly reacted with activated Ti cation to produce TiC layer. Subsequently, the intimal C atoms gradually diffused through the newly formed TiC layer to participate in the carbonization reaction because C atoms have a much higher speed of traversing TiC than that of Ti atoms crossing TiC [29]. Due to the absence of chemical bond between every adjacent graphene in the crystalline graphite, the long-range order carbon atoms close to the GF surface easily transform Figure 9a delineates the representative HRTEM interface photograph of TiC/Cu interface.…”

Section: Microstructure and Phase Composition Of Tic-coated Graphite mentioning

confidence: 99%

Improvement in Mechanical and Thermal Properties of Graphite Flake/Cu Composites by Introducing TiC Coating on Graphite Flake Surface

Zhang

Liu

et al. 2019

Metals

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In this work, TiC coating was successfully deposited on a graphite flake surface via molten salt technique, for the purpose of promoting the interfacial connection between Cu and graphite flake. Vacuum hot pressing was then employed to prepare TiC-coated graphite flake/Cu composite. The results indicate that introducing TiC coating on graphite flake surface can evidently reduce the pores and gaps at the interface, resulting in a significant improvement on the bending strength. When the TiC-coated graphite flake content is 60 vol%, the bending strength is increased by 58% compared with the uncoated one. The coefficient of thermal expansion dropped from 6.0 ppm·K−1 to 4.4 ppm·K−1, with the corresponding thermal conductivity as high as 571 W·m−1·K−1. The outstanding thermal conductivity, apposite coefficient of thermal expansion, as well as superior processability, make TiC-coated graphite flake/Cu composite a satisfactory electronic packaging material with vast prospect utilized in microelectronic industry.

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Market and Future Prospects of High Thermal Conductivity Composite Materials

Hongda,

2023

Thermal Management Materials for Electronic Packaging

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Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond

Cited by 123 publications

References 51 publications

High thermal conductive copper/diamond composites: state of the art

High thermal conductive copper/diamond composites: state of the art

Improvement in Mechanical and Thermal Properties of Graphite Flake/Cu Composites by Introducing TiC Coating on Graphite Flake Surface

Market and Future Prospects of High Thermal Conductivity Composite Materials

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