2013
DOI: 10.1016/j.apsusc.2013.07.051
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Effect of texturing process involving saw-damage etching on crystalline silicon solar cells

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Cited by 22 publications
(11 citation statements)
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“…The etching is the standard procedure adopted to eradicate edge shunts and sawing defects. Researchers have investigated the effect of etching on the deformation of micro-cracks and found that neither alkaline, nor acidic etching had a significant effect on the length of the crack [36][37][38]. However, the depth of the crack was reduced since the silicon material was washed away from the edges of the crack.…”
Section: Micro-defects In Solar Wafers/cellsmentioning
confidence: 99%
See 1 more Smart Citation
“…The etching is the standard procedure adopted to eradicate edge shunts and sawing defects. Researchers have investigated the effect of etching on the deformation of micro-cracks and found that neither alkaline, nor acidic etching had a significant effect on the length of the crack [36][37][38]. However, the depth of the crack was reduced since the silicon material was washed away from the edges of the crack.…”
Section: Micro-defects In Solar Wafers/cellsmentioning
confidence: 99%
“…Furthermore, the etching duration also has a significant effect on the stability of the solar wafer. The duration of etching significantly reduces the material thickness, thereby resulting in a fragile wafer which is prone to subsequent cracking [36][37][38][39][40][41]. Kim et al [36], Xianfang et al [32] and Schneider et al [41] reported that mechanical edge isolation and etching processes resulted in ∼10-25% reduction in mechanical durability of the solar wafer.…”
Section: Micro-defects In Solar Wafers/cellsmentioning
confidence: 99%
“…The starting wafers were commercial PV-grade 156 × 156 mm 2 cast mono-Si with the resistivity of approximately 3 Ωcm, thickness of 180 µm and <100> orientation. After diamondwire sawing the wafers from the ingot, the wafer surfaces had experienced the PV industry-standard alkaline-based saw damage etching [15]. Such etching results in a slightly rough surface as seen in the scanning electron microscope (SEM) image in Fig.…”
Section: Introductionmentioning
confidence: 99%
“…Kim et al [15] investigated how the wet chemical etching process to form random pyramids was affected by surface conditions. The p-type (100) mono-crystalline silicon wafers with a resistivity of 0.5-3.0 Ωcm and thickness of 200 µm was used.…”
Section: Tmah Etchant+ Isopropyl Alcohol (Ipa)mentioning
confidence: 99%