Effect of substructure on intergranular cavitation at high temperature

Lim, L. C.; Lu, H. H.

doi:10.1016/0956-716x(94)90217-8

Cited by 11 publications

(3 citation statements)

References 12 publications

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“…In Refs. [18] and [30] it was assumed that creep cavities in pure copper are mainly formed at cell and subboundary junctions with the grain boundaries. It will now be demonstrated with the help of a model by Lim [16] that this is feasible and that the effect of phosphorus can be explained.…”

Section: Modelmentioning

confidence: 99%

Grain boundary sliding in copper and its relation to cavity formation during creep

Sandström

Hagström

2016

Materials Science and Engineering: A

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Section: Modelmentioning

confidence: 99%

Grain boundary sliding in copper and its relation to cavity formation during creep

Sandström

Hagström

2016

Materials Science and Engineering: A

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“…Detailed ex situ studies of elevated‐temperature cavitation in Fe, Cu, and brass using transmission electron microscopy (TEM) suggest that both grain‐boundary defects and the accumulation of intragranular dislocations are critical to cavitation 30–33 . Others proposed that the combined stress concentration created by grain‐boundary pileups at a sliding grain boundary leads to cavity formation 34,35 …”

Section: Introductionmentioning

confidence: 99%

“…[30][31][32][33] Others proposed that the combined stress concentration created by grain-boundary pileups at a sliding grain boundary leads to cavity formation. 34,35 Because of the challenges in determining why some boundaries cavitate, the subject of cavitation-resistant grain boundaries has also received significant attention. In FCC metals, coherent twin boundaries, that is, Σ3 {111} tilt boundaries, are particularly resistant to cavitation.…”

Section: Introductionmentioning

confidence: 99%

Identifying the microstructural features associated with void nucleation during elevated‐temperature deformation of copper

Noell

Deka

Sills

et al. 2022

Fatigue Fract Eng Mat Struct

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The microstructural-scale mechanisms that produce cracks in metals during deformation at elevated temperatures are relevant to applications that involve thermal exposure. Prior studies of cavitation during high-temperature deformation, for example, creep, suffered from an inability to directly observe the microstructural evolution that occurs during deformation and leads to void nucleation. The current study takes advantage of modern high-speed electron backscatter diffraction (EBSD) detectors to observe cavitation in oxygen-free, high-conductivity copper in situ during deformation at 300 C. Most voids formed at the triple junction between a twin boundary and a high-angle grain boundary (HAGB). This finding does not contradict previous studies that suggested that twins are resistant to cracking-it reveals that cracks in HAGBs originate at twin/HAGB triple junctions and that cracks preferentially grow along HAGBs rather than the accompanying twins. Atomistic simulations explored the origins of this observation and suggest that twin/HAGB triple junctions are microstructural weak points.

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Cavitation

Sandström

2024

Springer Series in Materials Science

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Cavitation is of great technical importance. Nucleated cavities grow and link to form cracks that can cause rupture. During creep, cavities are initiated in the grain boundaries. The nucleation takes place at particles or at subboundary—grain boundary junctions. The main mechanism is believed to be grain boundary sliding (GBS), Chap. 9. According to the double ledge model, cavities are formed when the particles or subboundaries meet other subboundaries. With this assumption quantitative models for cavity nucleation can be derived. They show that the nucleated number of cavities is proportional to the creep strain in good accordance with observations. Cavities can grow by diffusion or by straining. It is important to take into account that cavities cannot grow faster than the surrounding creeping matrix, which is referred to as constrained growth. Otherwise the growth rate can be significantly overestimated. Models both for diffusion and strain controlled growth have been available for a long time. A recently developed model for strain controlled growth is presented based on GBS. It has the advantage that is associated with a well-defined initiation size of cavities and that constrained growth is automatically taken into account, features that some previous strain controlled models miss.

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Effect of substructure on intergranular cavitation at high temperature

Cited by 11 publications

References 12 publications

Grain boundary sliding in copper and its relation to cavity formation during creep

Grain boundary sliding in copper and its relation to cavity formation during creep

Identifying the microstructural features associated with void nucleation during elevated‐temperature deformation of copper

Cavitation

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