Effect of Substrate Grain Size on Structural and Corrosion Properties of Electrodeposited Nickel Layer Protected with Self-Assembled Film of Stearic Acid

Nezhad, Amir Hossein Noorbakhsh; Rahimi, Ehsan; Arefinia, Reza; Davoodi, Ali; Hosseinpour, Saman

doi:10.3390/ma13092052

Cited by 14 publications

(5 citation statements)

References 42 publications

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“…Other factors that influence the character of SAMs are the sort of metal and its surface roughness (characterized by root-mean-square roughness Rrms) [ 49 ]. Generally, a rougher surface allows adsorption of more active molecules, but the irregularity baulks the formation of a densely packed, compact layer.…”

Section: Self-assembled Nanolayersmentioning

confidence: 99%

Formation of Self-Assembled Anticorrosion Films on Different Metals

Telegdi

2020

Materials

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The review will first discuss shortly the phenomenon of corrosion and enroll some general possibilities to decrease the rate of this deterioration. The stress will be laid upon the presentation of anticorrosive self-assembled molecular (SAM) layers as well as on the preparation technology that is a simple technique, does not need any special device, and can be applied on different solids (metals or non-metals) alone or in combination. The paper groups the chemicals (mainly amphiphiles) that can develop nanolayers on different pure or oxidized metal surfaces. The history of the self-assembled molecular layer will be discussed from the beginning of the first application up to now. Not only the conditions of the nanofilm preparation as well as their characterization will be discussed, but the methods that can evaluate the corrosion-inhibiting efficiency of the SAM layers under a corrosive environment will be demonstrated as well.

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Section: Self-assembled Nanolayersmentioning

confidence: 99%

Formation of Self-Assembled Anticorrosion Films on Different Metals

Telegdi

2020

Materials

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“…The effect of the grain size of copper serving as a substrate for nickel film electrodeposition revealed a more hydrophilic behavior of the nickel film deposited on bigger copper grains. This was traced back to an indirect influence of the substrate grain size as the deposited nickel films were more homogeneous on the smaller copper grains . Noorbakhsh Nezhad et al also mentioned adsorbed hydrocarbons as a source for wetting differences.…”

Section: Introductionmentioning

confidence: 99%

“…This was traced back to an indirect influence of the substrate grain size as the deposited nickel films were more homogeneous on the smaller copper grains . Noorbakhsh Nezhad et al also mentioned adsorbed hydrocarbons as a source for wetting differences. On copper thin films, Platzman et al found higher contact angles on annealed films with less defects and grain boundaries and therefore expected reduced surface energy.…”

Section: Introductionmentioning

confidence: 99%

The Influence of Adventitious Carbon Groups on the Wetting of Copper: A Study on the Effect of Microstructure on the Static Contact Angle

Lößlein,

Merz,

Müller

et al. 2023

Langmuir

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Tuning of the wetting behavior of metallic surfaces by chemical and topographical modification has become popular in recent years. Still, there is a lack in the understanding of fundamental relations between intrinsic properties of the material and its resulting water contact angle. It is widely accepted in the literature that transitions from a hydrophilic to increasingly hydrophobic behavior upon exposure to ambient conditions happen due to the adsorption of adventitious hydrocarbons. In order to investigate the role of metallic bulk microstructure in the wetting behavior and its transition properties, we created three different grain sizes and deformation states on copper by preparation combined with heat treatment. We found that for freshly prepared surfaces, differences in the wetting behavior show a higher static contact angle for mechanically prepared surfaces with a fine-crystalline deformation layer compared to the electropolished cold-rolled copper sheet and the annealed defect-free coarse-grained surface. Already after five days of storage time, most of this difference vanishes, and all surfaces show a wetting behavior with a contact angle in the range of 97–100° after 30 days. Though long-term wetting behavior seems largely independent of microstructure, correlated XPS measurements showed an increased adsorption of organic contaminants of the mechanically polished surface. Preparation-induced near-surface defects seem to accelerate adsorption, while varying grain size and slight bulk deformation from rolling processes did not show significant effects. Complex relations between the amount of adsorbed carbon and the polarity of the adsorption film were found to depend on the sample age and influence the contact angle.

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“…Nickel, as an industrial metal, has extremely important applications in many engineering fields, such as airplanes, radars, and batteries, due to its excellent ductility, magnetism, and mechanical properties [1][2][3][4]. In addition, nickel itself is not easily corroded and is widely used as a protective layer on device surfaces [5,6]. Although nickel can be used as a protective metal, its corrosion protection is limited.…”

Section: Introductionmentioning

confidence: 99%

Wire Electrochemical Etching of Superhydrophobic Nickel Surfaces with Enhanced Corrosion Protection

Wu,

Yan,

Lin

et al. 2023

Materials

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Superhydrophobic nickel surfaces have significant advantages in the field of corrosion protection compared with traditional nickel corrosion protection methods which need a toxic chemical corrosion inhibitor. Electrochemical etching, an ideal method for fabricating superhydrophobic nickel surfaces, was also limited by low current density, resulting in low processing efficiency. To overcome this limitation, we proposed a new method to fabricate a superhydrophobic nickel surface using a wire electrochemical etching method. The wire electrochemical etching method accomplished the etching process by sweeping a controlled wire cathode across the surface of the anode nickel plate in an environmentally friendly neutral electrolyte, NaCl. The superhydrophobic nickel sample with a contact angle of 153° and a rolling angle of 10° could be fabricated by wire electrochemical etching and modification. Additionally, the optimal parameters of the wire electrochemical etching and the principle of superhydrophobic surface formation had also been systematically investigated, respectively. Moreover, the superhydrophobic nickel surface had self-cleaning performance, antifouling performance, corrosion protection, and abrasion resistance. Wire electrochemical etching improves the current density of processing, which means that this method improves the processing efficiency for fabricating a superhydrophobic nickel surface. This work is expected to enrich the theory and technology for fabricating superhydrophobic nickel surfaces to improve the corrosion protection of nickel.

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Effect of Substrate Grain Size on Structural and Corrosion Properties of Electrodeposited Nickel Layer Protected with Self-Assembled Film of Stearic Acid

Cited by 14 publications

References 42 publications

Formation of Self-Assembled Anticorrosion Films on Different Metals

Formation of Self-Assembled Anticorrosion Films on Different Metals

The Influence of Adventitious Carbon Groups on the Wetting of Copper: A Study on the Effect of Microstructure on the Static Contact Angle

Wire Electrochemical Etching of Superhydrophobic Nickel Surfaces with Enhanced Corrosion Protection

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