KEM 2009 DOI: 10.4028/ View full text
Jia Chun Wang, Ji Min Zhang, Na Li, Yun Peng Kou

Abstract: In nanometric cutting process, the actual material removal can take place at atomic level, which makes it difficult or impossible to observe the machining phenomena and measure the cutting parameters in experiments. However, it is crucial to investigate the cutting process in nanoscale. In this study, the molecular dynamics (MD) method is employed to model and simulate the process of cutting monocrystalline copper. The two-body Morse potential and the many-body EAM potential are used for the atoms interaction …

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