Effect of one-step recrystallization on the grain boundary evolution of CoCrFeMnNi high entropy alloy and its subsystems

Chen, Bo-Ru; Yeh, An‐Chou; Yeh, Jien‐Wei

doi:10.1038/srep22306

Cited by 57 publications

(18 citation statements)

References 32 publications

(50 reference statements)

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“…The equimolar multicomponent alloys, recently dubbed as the medium-entropy alloys (MEAs) ( 1 – 6 ) and high-entropy alloys (HEAs) ( 7 – 25 ), are emerging as an interesting class of structural materials. The single-phase CrCoNi and FeCrMnCoNi alloys of the face-centered cubic (FCC) structure, in particular, have exhibited a combination of high ultimate tensile strength, ductility, and fracture toughness ( 1 , 2 , 5 , 9 , 10 ).…”

mentioning

confidence: 99%

Dynamically reinforced heterogeneous grain structure prolongs ductility in a medium-entropy alloy with gigapascal yield strength

Yang

Yan

Yuan

et al. 2018

Proc. Natl. Acad. Sci. U.S.A.

384

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SignificanceBack stress hardening is usually not obvious in single-phase homogeneous grains, but can be made unusually large and sustained to large tensile strains by creating an unusually heterogeneous grain structure in single-phase alloys with low stacking fault energy (SFE), as demonstrated here for the face-centered cubic CrCoNi medium-entropy alloy. The low SFE facilitates the generation of twinned nanograins and stacking faults during tensile straining, dynamically reinforcing the heterogeneity. Large uniform tensile strain can be achieved after yielding even at gigapascal stress, in the absence of heterogeneities from any second phase.

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mentioning

confidence: 99%

Dynamically reinforced heterogeneous grain structure prolongs ductility in a medium-entropy alloy with gigapascal yield strength

Yang

Yan

Yuan

et al. 2018

Proc. Natl. Acad. Sci. U.S.A.

384

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“…Therefore, it is considered that the lowering the SFE is effective to reduce the twin boundary energy [47][48][49], which stimulates the formation of annealing twinning boundaries. FeNiCoCrMn samples subjected to annealing at 800 °C for 0.5, 2 and 24 hours following the swaging process.…”

mentioning

confidence: 99%

A comparison study of dislocation density, recrystallization and grain growth among nickel, FeNiCo ternary alloy and FeNiCoCrMn high entropy alloy

Thirathipviwat

Song

Jayaraj

et al. 2019

Journal of Alloys and Compounds

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The microstructural evolutions in terms of dislocation density, annealing twin density as well as with respect to microstructural changes due to recrystallization and grain growth were investigated in pure Ni, equiatomic FeNiCo alloy, and FeNiCoCrMn high entropy alloy (HEA) during the thermomechanical process. All samples were single phase and showed a face-centered cubic (FCC) lattice structure. This was maintained during thermomechanical processing comprising of cold swaging by 85 % reduction of crosssectional area and subsequent annealing at 800°C. The level of dislocation accumulation during cold swaging increased with the number of constituent elements. The FeNiCoCrMn HEA obtained the highest dislocation density, followed by the FeNiCo and Ni, respectively. After the annealing at 800°C for 0.5 hours, all samples achieved the large fraction of recrystallized grains with minor fraction of substructured grains and no deformed grain. The FeNiCoCrMn HEA obtained the smallest recrystallized grain size ( 5 m) after the annealing at 800°C for 0.5 hours. This could be a result of the highest dislocation density generated during cold swaging prior to the annealing. The prolonged annealing at 800 °C for up to 24 hours 2 led to a grain growth for all the samples, however, at different growth rates. The FeNiCoCrMn HEA revealed the lowest rate of grain growth, but the microstructural changes during the annealing were not significantly different between the FeNiCo and Ni samples. Besides the effect of the number of constituent elements, the type and the combination of constituent elements have an effect on the microstructural evolution during the annealing.

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“…This latter group is defined as the recrystallized fraction. [23][24][25] Applying this same analysis to our study, we observe that an unexposed single-grain reference solder ball presents itself as a substructured grain, i.e., 0 pct recrystallized grains (Figure 12(a)). Similar observations were made for multigrain reference solder balls where substructured grains were predominant.…”

Section: Liquid Ga Penetration Into Sac305 Soldersmentioning

confidence: 79%

Gallium Liquid Metal Embrittlement of Tin-based Solder Alloys

Nguena

Danovitch

Sylvestre

et al. 2020

Metall Mater Trans A

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We report on the embrittlement of tin (Sn)-based solder by liquid gallium (Ga). Exposure to liquid Ga results in a degradation of the intrinsic mechanical properties of the solder due to its ductile-to-brittle transition. Important changes in the solder microstructure accompany this degradation and are predominantly associated with a spontaneous recrystallization of Sn during Ga diffusion into the solder. A detailed investigation of the solder microstructure evolution identifies the recrystallization process as a Continuous Static Recrystallization (C-SRX). Taking into account mechanisms of atomic transport as well as the creation and propagation of defects, a novel liquid metal embrittlement (LME) model is herein proposed, namely the Diffusion-Induced Recrystallization Evolution (DIRE) model.

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Effect of one-step recrystallization on the grain boundary evolution of CoCrFeMnNi high entropy alloy and its subsystems

Cited by 57 publications

References 32 publications

Dynamically reinforced heterogeneous grain structure prolongs ductility in a medium-entropy alloy with gigapascal yield strength

Dynamically reinforced heterogeneous grain structure prolongs ductility in a medium-entropy alloy with gigapascal yield strength

A comparison study of dislocation density, recrystallization and grain growth among nickel, FeNiCo ternary alloy and FeNiCoCrMn high entropy alloy

Gallium Liquid Metal Embrittlement of Tin-based Solder Alloys

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