Effect of Copper Content on the Microstructural Properties of Mo-Cu-N Films

Abstract

Ternary Mo-Cu-N films were deposited on Si wafer substrates with various copper contents by magnetron sputtering method using Mo target and Cu target in Ar/N 2 gaseous atmosphere. As increasing N 2 pressure, the microstructure of Mo-N films changed from γ-Mo 2 N of (111) having face-centered-cubic (FCC) structure to δ-MoN of (200) having hexagonal structure. Detailed the microstructures of the Mo-Cu-N coatings were studied by X-ray diffraction, scanning electron microscopy and field emission transmission electron microscope. The results indicated that the incorporation of copper into the growing Mo-N coating led to the Mo . 그 중에서도 Si를 첨가하므로 40 GPa 이상 의 초고경도를 나타내는 nc-TiN/a-Si3N4와 같은 결 정질과 비정질로 이루어진 나노복합체 미세구조에 대한 연구가 활발히 진행되었다 [17][18][19] . 그러나, Cu, Ag와 같은 soft metal(SM)을 첨가한 다성분계 Me-SM-N에 대한 연구는 이제 시작단계라고 할 수 있 다 11-16). 그 중에서, Mo-Cu-N 박막의 경우 MoO 3 -CuO의 이성분계 산화물에 의해 매우 낮은 마찰계