Effect of aluminum addition on the electrochemical corrosion behavior of Sn–3Ag–0.5Cu solder alloy in 3.5 wt% NaCl solution

Fayeka, M.; Fazal, M. A.; Haseeb, A.S.M.A.

doi:10.1007/s10854-016-5374-8

Cited by 19 publications

(6 citation statements)

References 29 publications

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“…Therefore, Al would take the priority if the dissolution reaction was attacked. The reactions occurred according to the following steps [33]:Al + 3OH − − 3e − → Al(OH) 3 …”

Section: Resultsmentioning

confidence: 99%

Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

Yang

et al. 2019

Materials

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This study investigates the effect of aluminum (Al) on the microstructure, micro-hardness, and wettability of environmentally friendly Sn-20Bi-xAl (x = 0, 0.1, 0.3, 0.5 (wt.%)) solder alloys. Scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS) analysis, and X-ray diffraction (XRD), were used to identify the microstructure morphology and composition. The spreading area and contact angle of the Sn-20Bi-xAl alloys on Cu substrates were used to measure the wettability of solder alloys. The results indicate that Al increased the hardness to a maximum value of ~27.1 HV for x = 0.5. When the content of Al was more than 0.3 wt.%, the hardness change value gradually flattened. From the spreading test results, Al reduced the wettability of solder alloys. When the content of Al was 0.1 wt.%, the change was slight. When more than 0.3 wt.%, the wettability of Sn-20Bi-xAl solder alloys sharply dropped. The corrosion resistance of Sn-20Bi-0.1Al alloy was the best, and the corrosion rate was at the lowest value at 0.092 mm/a due to the dense corrosion products.

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“…Therefore, Al would take the priority if the dissolution reaction was attacked. The reactions occurred according to the following steps [33]:Al + 3OH − − 3e − → Al(OH) 3 …”

Section: Resultsmentioning

confidence: 99%

Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

Yang

et al. 2019

Materials

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“…The polarization reaction process of the composite solders was analyzed as an example of Sn-0.7Cu-0.08 wt.% Ni@C. The polarization curve is divided into four sections, including AB, BC, CD, and DE. The AB section is the process of the oxygen-consuming reduction reaction, which occurs at the cathode [29]. The reaction process is shown in Equation ( 2), in which the solder is not involved in the reaction process.…”

Section: Analysis Of Electrochemical Corrosion Process Of Sn-07cu-xni...mentioning

confidence: 99%

Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

Lin

Gao

et al. 2022

Metals

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The corrosion resistance of solder joints is a critical factor affecting the service life of electronic products during long-term operation. In this study, the corrosion behavior of Sn-0.7Cu-xNi@C (x = 0, 0.04, 0.08, and 0.12 wt.%) composite solders was investigated using a Tafel polarization curve in 3.5 wt.% NaCl solution, and the result demonstrated that it was the Ni@C that enhanced the corrosion resistance of the composite solder. The corrosion rate of the composite solders decreased with increasing Ni@C content and reached the lowest value of 0.205 mm/y when the content of Ni@C reached 0.08 wt.%. Ni@C changed the morphologies of corrosion products Sn3O(OH)2Cl2 from thick flakes to dense fine needles and flakes, which made it more difficult for Cl– to break down corrosion products. Thus, the corrosion resistance of composite solder was improved. The carbon skeleton in Ni@C served as an inert physical barrier to inhibit further corrosion. Furthermore, the potential difference between IMC and β-Sn decreased with the addition of Ni@C, which reduced the corrosion rate of the electric couple and enhanced the corrosion resistance of the composite solder.

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“…While mechanical and physical properties of these new alloys are always evaluated, the same cannot be said for their corrosion behaviour. Although numerous attempts have been conducted to investigate the corrosion behaviour of lead-free solder alloys [29][30][31][32][33][34][35][36][37][38], there is still little information regarding the galvanic corrosion of solder alloys in contact to Cu or Ni substrates; in fact, only a few studies have been reported to date [39,40].…”

Section: Introductionmentioning

confidence: 99%

Galvanic corrosion analysis of a Bi–Zn solder alloy coupled to Ni and Cu substrates

Septimio

Arenas

Conde

et al. 2020

Corrosion Engineering, Science and Technology

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Corrosion has become a frequent and significant issue in the electronics industry. For this reason, galvanic corrosion of soldered joints, i.e. when solder alloys are in contact with a metallic substrate, is so important. The present study aims to investigate the corrosion behaviour of the Bi-2.7wt-%Zn solder alloy when in contact with Cu and Ni substrates in a 0.06M NaCl solution. Polarisation curves show that Ni and Cu have nobler behaviour than the Bi-Zn alloy. However, although the Bi-Zn alloy exhibits active corrosion behaviour, the open circuit potential tends to shift toward more positive potentials over time. The galvanic current densities (i galv ) of both Bi-Zn alloy/Ni and Cu couples are initially similar and three times higher than the corrosion current density of the Bi-Zn alloy. However, the couples show a decrease in i galv. , with time and the couple formed with Ni has produced the lowest galvanic current density.

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Effect of aluminum addition on the electrochemical corrosion behavior of Sn–3Ag–0.5Cu solder alloy in 3.5 wt% NaCl solution

Cited by 19 publications

References 29 publications

Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

Galvanic corrosion analysis of a Bi–Zn solder alloy coupled to Ni and Cu substrates

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