2020
DOI: 10.1016/j.ijplas.2020.102834
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Dynamics of edge dislocation in Cu–Ni solid solution alloys at atomic scale

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Cited by 38 publications
(10 citation statements)
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“…[ 39 ] It is generally understood that the existence of solute atoms increases the onset threshold stress of barrier‐free dislocation motion. [ 40 ] The morphologies of the dislocations at the moment when the average shear stress reaches the CRSS are shown in Figure 4 and 5 . The Al atoms are hidden.…”
Section: Resultsmentioning
confidence: 99%
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“…[ 39 ] It is generally understood that the existence of solute atoms increases the onset threshold stress of barrier‐free dislocation motion. [ 40 ] The morphologies of the dislocations at the moment when the average shear stress reaches the CRSS are shown in Figure 4 and 5 . The Al atoms are hidden.…”
Section: Resultsmentioning
confidence: 99%
“…The strengthening caused by solute atoms is affected by temperature. [ 40 ] It is well known that the increase in temperature reduces the strengthening effect of solute atoms, which has been demonstrated experimentally. [ 41 ] To verify the applicability of the Equation (8) at different temperatures, systems with different concentrations of solute atoms are simulated at 100 and 500 K, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…Therefore, the effect of oxygen atom concentration on the velocity of dislocation movement at high temperature is much smaller than that at low temperature. Similarly, molecular dynamics simulations of Cu–Ni solid solution alloys revealed that the dislocation mobility is almost unaffected by the solute atom concentration at temperatures above 700 K. [ 23 ]…”
Section: Resultsmentioning
confidence: 99%
“…However, when interstitial oxygen is added (Figure 6c–f), the degree of bending after dislocation movement shows no significant difference under low and high stresses, thus implying that the degree of bending is almost unaffected by the solute‐induced stress field. [ 23 ]…”
Section: Resultsmentioning
confidence: 99%
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