Dynamic Weld evolution during ultrasonic welding of Cu–Al joints

Ma, Qiuchen; Song, Cheng; Zhou, Jianli; Zhang, Lin; Ji, Hongjun

doi:10.1016/j.msea.2021.141724

Cited by 39 publications

(17 citation statements)

References 58 publications

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“…In general, the annealing treatment was observed to reduce the degree of disorder in the atoms near the interface and increase the strain that corresponded to the onset of nanovoid generation, which resulted in improved strength of the interface. The fracture surface was observed to be relatively smooth, as noted in a prior experimental study [ 21 ].…”

Section: Modeling and Simulationsupporting

confidence: 65%

“…Accurate mesoscale models have been implemented in analyzing the mechanical performance of CuSn [ 2 ] and fine-grained high-strength steels [ 19 ]. With the newly developed interaction potential for MD methods, the strengths of binary and ternary systems, such as Al–Cu [ 20 , 21 ], Cu–Zr [ 22 ], Ti–V–N [ 23 ], Cr–Fe [ 24 ], and high entropy alloy systems [ 25 , 26 ] have been studied as well. However, there are very few comprehensive studies that provide insights into the failure processes that are initiated at the interfaces.…”

Section: Introductionmentioning

confidence: 99%

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On the Evolution of Nano-Structures at the Al–Cu Interface and the Influence of Annealing Temperature on the Interfacial Strength

Wang

Cheng²,

Zhang³

et al. 2022

Nanomaterials

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Molecular dynamics (MD) simulations are invoked to simulate the diffusion process and microstructural evolution at the solid–liquid, cast-rolled Al–Cu interfaces. K-Means clustering algorithm is used to identify the formation and composition of two types of nanostructural features in the Al-rich and Cu-rich regions of the interface (i.e., the intermetallic Al2Cu near the Al-rich interface and the intermetallic Al4Cu9 near the Cu-rich interface). MD simulations are also used to assess the effects of annealing temperature on the evolution of the compositionally graded microstructural features at the Al–Cu interfaces and to characterize the mechanical strength of the Al–Cu interfaces. It is found that the failure of the Al–Cu interface takes place at the Al-rich side of the interface (Al2Cu–Al) which is mechanically weaker than the Cu-rich side of the interface (Cu–Al4Cu9), which is also verified by the nanoindentation studies of the interfaces. Centrosymmetry parameter analyses and dislocation analyses are used to understand the microstructural features that influence deformation behavior leading to the failure of the Al–Cu interfaces. Increasing the annealing temperature reduces the stacking fault density at the Al–Cu interface, suppresses the generation of nanovoids which are precursors for the initiation of fracture at the Al-rich interface, and increases the strength of the interface.

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Section: Modeling and Simulationsupporting

confidence: 65%

Section: Introductionmentioning

confidence: 99%

On the Evolution of Nano-Structures at the Al–Cu Interface and the Influence of Annealing Temperature on the Interfacial Strength

Wang

Cheng²,

Zhang³

et al. 2022

Nanomaterials

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“…Introducing external field effects into the welding process, such as friction-stir welding, electromagnetic welding, and ultrasonic welding (UW), is able to facilitate the rate of solid-phase bonding. , Within them, UW has attracted significant attention in the fields of electronic, automotive, and aerospace industries because of its considerably shorter welding time (even < 1 s), lower energy consumption (room temperature welding), cleanliness, and reliability. − High-frequency ultrasonic vibration energy can be transformed into frictional work, deformation energy, and limited temperature rise at the welding interface, dramatically accelerating the diffusion and entanglement of polymer chains. , Therefore, UW holds the potential to enable the high-efficiency integration of heterostructured LCEs. To realize the UW of LCEs, the aforementioned exchangeable LCEs should be developed to behave like reprocessible thermoplastics.…”

Section: Introductionmentioning

confidence: 99%

Ultrasonic-Excited Ultrafast Seamless Integration of Heterostructured Liquid Crystalline Elastomers for Multi-responsive Soft Actuators

Zheng

Yuan

et al. 2023

ACS Appl. Mater. Interfaces

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Multicomponent/heterostructured liquid crystalline elastomers (LCEs) have recently garnered extensive attention for the design of soft robots with high dexterity and flexibility. However, the reported integration strategies of LCEs seriously suffer from high welding temperature, long processing time, and poor joint quality. Herein, the high-efficiency seamless ultrasonic welding (UW) of reprogrammable silver nanowire−LCE composites (AgNW−LCEs) have been realized without any auxiliary reagents based on the dynamic silver− disulfide coordination interactions. The elaborate combination of silver− disulfide coordination interactions and UW technology establishes an effective double-network welding mechanism of AgNWs and dynamic LC networks due to the high-frequency vibration at the welding interface. During the UW process, monolithic AgNW−LCEs can be integrated into heterostructured actuators at room temperature for 0.68 s. Furthermore, the welded AgNW−LCEs demonstrate an exceptional strain healing efficiency of ∼100%, a stress healing efficiency of ∼85%, and a maintained orientation of the LC alignment. Taking advantage of the high-efficiency UW technology, the heterostructured AgNW−LCE actuators with different LC alignments or LC monomers have been successfully implemented for a multi-degree-of-freedom soft robotic arm and a time-modulated flower-mimic actuator. This work provides an efficient approach toward the development of multi-responsive entirely soft actuators based on smart polymers.

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“…On the atomic scale, molecular dynamics (MD) simulations have exerted attention on the atomic and strain-energy distributions at Al/Al, Cu/Al, Cu/Cu and Ti/Al interfaces joined via an UV-assisted method, 27–35 giving insights into the effect of UVs on the structural evolution of joints. However, there are still no direct images capturing atomic-scale motions of dislocations which, together with atomic diffusion, are involved and essential in material flow and plastic deformation in Mg/Al UVeFSW processes.…”

Section: Introductionmentioning

confidence: 99%