2013
DOI: 10.1109/jphotov.2012.2219851
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Dislocation Density Reduction During Impurity Gettering in Multicrystalline Silicon

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Cited by 22 publications
(25 citation statements)
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“…The gettering process is known to be effective at dissolving metal impurity precipitates to o2-5 nm in size; however, the material performance was sometimes not greatly enhanced [153]. Under specific conditions, impurities play a positive role in removing dislocations [154]. An effort was made to annihilate dislocations in mc-Si at temperatures as low as 820°C with the assistance of an additional driving force to stimulate dislocation motion.…”
Section: Effect Of Point Defectsmentioning
confidence: 99%
“…The gettering process is known to be effective at dissolving metal impurity precipitates to o2-5 nm in size; however, the material performance was sometimes not greatly enhanced [153]. Under specific conditions, impurities play a positive role in removing dislocations [154]. An effort was made to annihilate dislocations in mc-Si at temperatures as low as 820°C with the assistance of an additional driving force to stimulate dislocation motion.…”
Section: Effect Of Point Defectsmentioning
confidence: 99%
“…Thus far, remediation efforts have been focused on avoiding dislocation nucleation during the casting process , and post‐growth dislocation density reduction . A high‐temperature isothermal annealing, near the melting point of silicon has been reported to result in significant dislocation density reduction, possibly by pairwise annihilation of dislocations with opposite Burger's vector signs .…”
Section: Introductionmentioning
confidence: 99%
“…Today in commercial production, a high‐temperature plateau is employed during ingot growth to reduce dislocation densities and residual stress. Studies have also suggested that small amounts of residual or external stress , or the presence of unidirectional flux of point defects , may stimulate dislocation motion, accelerating dislocation annihilation.…”
Section: Introductionmentioning
confidence: 99%
“…In p-type Si solar cell processing, the n-p junction is formed by high concentration P in-diffusion from a gaseous, liquid, or solid source [70] that leads to formation of n-type emitter at the top surface of the wafer [69]. Fast diffusing metal impurities, such as iron, nickel, and copper from silicon feedstock material or introduced, during ingot growth and solar-cell processing, can be gettered from grains with lowdislocation densities, increasing the minority carrier lifetime in these regions [71].…”
Section: From Ingot To Modulesmentioning
confidence: 99%
“…In regions with high dislocations clusters, the gettering process is minimally effective, meaning that the impurity gettering cannot overcome the limits imposed by the crystallographic defects in high dislocation densities areas [73]. Dissolved metal point defects or metal-silicide precipitates may segregate to the dislocation strain field and/or bind to the dislocation core, creating deep-level recombination centers that are additional energy barriers to gettering and detrimental to solar-cell performance [71].…”
Section: From Ingot To Modulesmentioning
confidence: 99%