2018
DOI: 10.1007/s00289-018-2581-x
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Dielectric properties and thermal conductivity of epoxy resin composite modified by Zn/ZnO/Al2O3 core–shell particles

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Cited by 24 publications
(12 citation statements)
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“…The component materials widely used at present can no longer meet the requirements of heat dissipation due to its low thermal conductivity and has faced a situation of renewal. 1,2 It is well known that the electronic components require not only good electrical properties, but also excellent thermal conductivity, mechanical strength and flexibility. 3 Ceramic and metal components which have been widely used can meet the requirements of components, but they are also suffering from various shortcomings, such as high brittleness, poor toughness, processing difficulty, high cost, etc.…”
Section: Introductionmentioning
confidence: 99%
“…The component materials widely used at present can no longer meet the requirements of heat dissipation due to its low thermal conductivity and has faced a situation of renewal. 1,2 It is well known that the electronic components require not only good electrical properties, but also excellent thermal conductivity, mechanical strength and flexibility. 3 Ceramic and metal components which have been widely used can meet the requirements of components, but they are also suffering from various shortcomings, such as high brittleness, poor toughness, processing difficulty, high cost, etc.…”
Section: Introductionmentioning
confidence: 99%
“…Research works related to epoxy composites filled with different types of core-shell particles can be found in the literature [ 18 , 19 , 20 , 21 , 22 ]. The results indicate that incorporation of the core-shell fillers, such as AlN@Al 2 O 3 particles or SiC@SiO 2 nanowires, can increase the storage modulus and improve the thermal conductivity [ 18 , 19 ].…”
Section: Introductionmentioning
confidence: 99%
“…The results indicate that incorporation of the core-shell fillers, such as AlN@Al 2 O 3 particles or SiC@SiO 2 nanowires, can increase the storage modulus and improve the thermal conductivity [ 18 , 19 ]. Epoxy composites with multilayer core-shell structured fillers, like Si@SiO 2 @polydopamine and Zn@ZnO@Al 2 O 3 , show an increase in dielectric constant and a reduction in dielectric loss, and the thermal conductivity of the composites is also significantly improved [ 20 , 21 , 22 ]. Nevertheless, these studies only investigate a limited set of features, and there is not enough emphasis put on the complete analysis of all of the critical parameters, which are highly important from an application point of view.…”
Section: Introductionmentioning
confidence: 99%
“…In order to reduce the damage of material properties caused by a large amount of heat generated during the electrical operation, the excellent thermal conductivity of materials is increasingly required [3][4]. As one of the universal thermosetting polymers, epoxy (EP) has been widely used as electronic components due to its high mechanical properties, low creep property and good oxidation resistance [5][6][7]. The thermal conductivity of pure EP is within the range of 0.17-0.23 W/mK, which can basically meet the requirements of common electronic components and materials [8][9].…”
Section: Introductionmentioning
confidence: 99%