KEM 2009 DOI: 10.4028/ View full text
Pei Qi Ge, Zhi Jian Hou, Shao Jie Li

Abstract: Because its advantages of lower manufacture cost and higher slicing quality, the resin bonded diamond wire saw is supposed to be used widely in the future for slicing hard-brittle materials such as silicon crystal. In this paper, based on the research of the resin bonded diamond wire saw manufacturing technology and slicing process, we select Φ0.2mm SWPB piano string as core wire, 20-30m (800#) diamond grain as abrasive, liquid phenolic resin mixed with epoxy resin as adhesive, the nanometer powders as additi…

expand abstract