Flexible and foldable or even stretchable OLED displays entering the market and are expected to grow 50% or more. This is requiring the display panel to become thinner and thinner while maintaining the robustness and reliability. This challenges existing material systems and require optimizing the whole system and not just individual layers. We are developing multiple solutions for cover film, encapsulation, and other leveraging expertise from our semiconductor technologies. Challenges to reach a combination of glass and rubber performance using Ultra‐Thin Glass (UTG), PET, Colorless PI (CPI), … in combination with hardcoat solutions and state‐of‐the‐art performance of hardcoat‐solutions will be discussed.