Development of Endless Diamond Wire Saw and Sawing Experiments

Ge, Pei Qi; Zhang, L.; Gao, Wenjie; Liu, Zhen Chang

doi:10.4028/www.scientific.net/msf.471-472.481

Cited by 13 publications

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“…[1][2][3] Moller 4 stated that the wire saw process is responsible for 30% of the total silicon wafer-production cost, which directly affects industry. There is a need to optimize the process by developing models relating process parameters to product quality and process efficiency measures.…”

Section: Introductionmentioning

confidence: 99%

Roughness damage evolution due to wire saw process

Teomete

2011

Int. J. Precis. Eng. Manuf.

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The wire saw process is widely used for silicon wafer production with high yield and low surface damage in solar cell and microelectronics industries. The wire saw process is used to machine brittle materials in the ductile regime where high yield and low surface damage are desired. The wire saw process is also used to cut concrete and rocks in civil engineering. In this study, an experimental parametric study was conducted by varying process parameters to determine surface roughness damage. Ductile regime material removal by trans-granular failure and brittle fracture by inter-granular failure are observed in electron micrographs of the cut surfaces. A damage model that relates the roughness damage to process parameters was derived. The damage model predicts the roughness damage satisfactorily. The model shows that the roughness damage is proportional to the ratio of feed speed to wire speed. Improvement in the efficiency of the process without increasing the roughness damage can be attained by increasing the feed speed proportionally to wire speed. Wire tension does not affect roughness damage. Roughness damage, however, is affected by properties of the wire. Wires having smaller grit radius and small grit spacing cause less roughness damage.

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Section: Introductionmentioning

confidence: 99%

Roughness damage evolution due to wire saw process

Teomete

2011

Int. J. Precis. Eng. Manuf.

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“…In the past decade, several major technical developments in diamond wire saw machining have emerged. Recently, some researchers, for example, Clark, Sugawara, Peng, and Furutani, have investigated diamond wire saws [5][6][7][8][9]. Three basic categories of diamond wire saw can be distinguished according to the kind of bonding material employed: metallic bonding materials, organic bonding materials, and resin bonding materials.…”

Section: Introductionmentioning

confidence: 99%

Formulation and Implementation of Energy Efficient Ultraviolet Curing for Photosensitive Resin-Bound Diamond Wire Saws

Yao

Peng

Liu

2013

Mathematical Problems in Engineering

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It is a currently dominant method to use wire saws for cutting silicon material because of its production efficiency and energy efficiency. Diamond wire saws, or fixed abrasive wire saws, have attracted much attention to researchers and engineers due to many advantages, including high cutting efficiency and low environmental pollution. This paper develops a novel diamond wire saw using ultraviolet curing technology. High-strength piano wires and polyethylene wires are selected as wire cores, and photosensitive resin is used as the binder. The problem of wire saw strength is mathematically formulated, and the effective parameters are analyzed. The surface morphology is analyzed for the developed diamond wire saw. A series of cutting experiments with different saws of varying manufacturing parameters are carried out. The slicing performance of such diamond wire saws is evaluated and compared. The experimental results show that the developed saw using the photosensitive resin has a very good performance in slicing silicon ingots. By the comparison between the developed diamond wire saw and the electroplated diamond wire saw, the surface smoothness of the workpiece is better than that by the latter.

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“…An endless diamond wire saw with electroplated diamond is used to cut granite by Ge et al (2004). The feed is applied as a constant weight load.…”

Section: Parametric Studies On the Wire Saw Processmentioning

confidence: 99%

“…The increase of hardness of material decreases efficiency and increases cutting forces. Use of coolant increases efficiency while cut forces decreases (Ge et al 2004).…”

Section: Parametric Studies On the Wire Saw Processmentioning

confidence: 99%

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Mechanics of wire saw machining process: experimental analyses and modeling

Teomete

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CHAPTER 1. INTRODUCTION AND LITERATURE REVIEW 2.4.1. Calibration of Load Cell Setup 36 2.5. Surface Roughness Measurements and SEM Imaging 2.6. Sample Preparation 2.7. Preliminary Results 2.7.1. The Effect of Wire Speed 39 2.7.2. The Effect of Feed Speed 40 2.7.3. The Effect of Wire Tension 40 2.7.4. The SEM Imaging Results 2.8. References CHAPTER 3. ROUGHNESS AND DAMAGE EVOLUTION DUE TO WIRE SAW PROCESS 55 3.1. Introduction 3.2. Experimental Process 3.2.1. Wire Saw Cutting and Wire Bow Angle Measurement 3.2.2. Surface Roughness Measurements and SEM imaging 3.3. Roughness Model Derivation 3.4. Results and Discussion 3.5. Conclusion 3.6. Acknowledgement 3.7. References

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Development of Endless Diamond Wire Saw and Sawing Experiments

Cited by 13 publications

References 0 publications

Roughness damage evolution due to wire saw process

Roughness damage evolution due to wire saw process

Formulation and Implementation of Energy Efficient Ultraviolet Curing for Photosensitive Resin-Bound Diamond Wire Saws

Mechanics of wire saw machining process: experimental analyses and modeling

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