Development and application of high-temperature sensors and electronics for propulsion applications

Hunter, Gary W.; Wrbanek, John D.; Okojie, Robert S.; Neudeck, Philip G.; Fralick, Gustave C.; Chen, Liang‐Yu; Xu, Jennifer; Beheim, Glenn M.

doi:10.1117/12.668458

Cited by 45 publications

(23 citation statements)

References 3 publications

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“…Thin film sensors are thought to be a superior choice compared to conventional wire and foil sensors since they are directly deposited onto the test part with a micrometers scale, which minimized the disturbance of the operating propulsion system [1][2][3]. Considering turbine engine blades and vanes are usually made of conductive nickel-based superalloy, a high quality insulator between the substrate and the sensor, which provides good insulation at high temperature are required.…”

Section: Introductionmentioning

confidence: 99%

High temperature sensors fabricated on Al 2 O 3 ceramic and nickel-based superalloy substrates

Wang

Zhang

Niu

et al. 2016

Sensors and Actuators A: Physical

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Section: Introductionmentioning

confidence: 99%

High temperature sensors fabricated on Al 2 O 3 ceramic and nickel-based superalloy substrates

Wang

Zhang

Niu

et al. 2016

Sensors and Actuators A: Physical

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“…• C [14]. To the best of our knowledge, no TSV architectures that are specifically designed for harsh environments have been proposed yet, and no complete TSV structures, including pads and interconnects, have been reported under thermal cycles wider than -65…”

Section: Introductionmentioning

confidence: 99%

Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications

Asiatici

Laakso

Fischer

et al. 2017

J. Microelectromech. Syst.

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Abstract-Through silicon vias (TSVs) are key enablers of 3D integration technologies which, by vertically stacking and interconnecting multiple chips, achieve higher performances, lower power and a smaller footprint. Copper is the most commonly used conductor to fill TSVs; however, copper has a high thermal expansion mismatch in relation to the silicon substrate. This mismatch results in a large accumulation of thermomechanical stress when TSVs are exposed to high temperatures and/or temperature cycles, potentially resulting in device failure.In this paper, we demonstrate 300 µm long, 7:1 aspect ratio TSVs with Invar as a conductive material. The entire TSV structure can withstand at least 100 thermal cycles from -50• C to 190• C and at least one hour at 365 • C, limited by the experimental setup. This is possible thanks to matching coefficients of thermal expansion (CTE) of the Invar via conductor and of silicon substrate. This results in thermomechanical stresses that are one order of magnitude smaller compared to copper TSV structures with identical geometries, according to finite element modelling. Our TSV structures are thus a promising approach enabling 2.5D and 3D integration platforms for high-temperature and harsh-environment applications.

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“…In addition, specialized sensors for the combustor include fuel flow, chemical species, and temperature sensors that can withstand high temperatures (typically 1000 °C) and can operate in the presence of byproducts from burning jet fuel. Not only the sensors need to operate at elevated temperatures; each sensor system typically includes processing electronics, and weight is reduced (hence fuel-burn reduced) by using wireless communications and locally-scavenged power [8]. Actuators are needed for flow control in the inlet, fan, compressor, and turbine; clearance control in the compressor and turbine; and for fuel modulation.…”

Section: Enabling Technologiesmentioning

confidence: 99%

“…Active tip-clearance control for low-pressure turbine (LPT) tech- 5 Active flow control for LPC tech- 6 Active flow control for HPC tech -7 Turbine aero-thermal and flow control for HPT and LPT tech- 8 Active combustion control for lean direct injection (LDI) combustor tech -9 Smart fan containment system tech- 10 High-temperature wireless data communication technology…”

Section: Introductionmentioning

confidence: 99%

A Probabilistic System Analysis of Intelligent Propulsion System Technologies

Tong

2007

Volume 1: Turbo Expo 2007

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NASA's Intelligent Propulsion System Technology (Propulsion 21) project focuses on developing adaptive technologies that will enable commercial gas turbine engines to produce fewer emissions and less noise while increasing reliability. It features adaptive technologies that have included active tip-clearance control for turbine and compressor, active combustion control, turbine aero-thermal and flow control, and enabling technologies such as sensors which are reliable at high operating temperatures and are minimally intrusive. A probabilistic system analysis is performed to evaluate the impact of these technologies on aircraft CO 2 (directly proportional to fuel burn) and LTO (landing and takeoff) NO x reductions. A 300-passenger aircraft, with two 396-kN thrust (85,000-pound) engines is chosen for the study. The results show that NASA's Intelligent Propulsion System technologies have the potential to significantly reduce the CO 2 and NO x emissions. The results are used to support informed decisionmaking on the development of the intelligent propulsion system technology portfolio for CO 2 and NO x reductions.

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Development and application of high-temperature sensors and electronics for propulsion applications

Cited by 45 publications

References 3 publications

High temperature sensors fabricated on Al 2 O 3 ceramic and nickel-based superalloy substrates

High temperature sensors fabricated on Al 2 O 3 ceramic and nickel-based superalloy substrates

Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications

A Probabilistic System Analysis of Intelligent Propulsion System Technologies

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