Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures

Dielectric Barrier, Etch Stop, and Metal Capping Materials for State of the Art and beyond Metal Interconnects

“…220 If not sufficiently dissipated away, this added thermal energy can lead to increases in local interconnect temperatures that can reduce the reliability of the interconnect structure and accelerate failure mechanisms such as TDDB and electromigration. 221 While metals have a high thermal conductivity and can self dissipate a lot of thermal energy from the interconnect structure, the effeciency of this is anticipated to diminish as the effective thermal conductivity of the metal decreases due to grain boundary and interfacial phonon scattering mechanisms becoming significant at <20 nm dimensions. 222 For this reason, insulating dielectrics with a high thermal conductivity are highly desirable, particularly for preventing hot spot generation where metal line density is either sparse or asymmetric.…”

Design and preparation of porous polybenzoxazole films using the tert-butoxycarbonyl group as a pore generator and their application for patternable low-k materials

“…Recent demand for the thermal management of electronic devices is to develop a material with a good thermal conductivity for next generation insulators. [44][45][46] We estimated the thermal conductivity (k) of the t-Boc-prePBO and PPBO films using the following equation (eqn (5)),…”

Investigation of defect characteristics and heat transfer in step heating thermography of metal plates repaired with composite patches

“…Some studies [11][12][13][14][15] have been previously performed to simulate heat transfer in anisotropic multilayers as well as composites. In the case of complicated structures and anisotropic material properties, numerical solutions such as finite element (FE) methods are preferred rather than the analytical approaches.…”