2016 IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific) 2016
DOI: 10.1109/itec-ap.2016.7513039
View full text
|
Sign up to set email alerts
|
Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2019
2019
2019
2019

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 4 publications
(1 citation statement)
references
References 6 publications
0
1
0
Order By: Relevance
“…The thicknesses of substrate and bare copper are 1.6 mm and 35.6 µm (1-oz copper), respectively. The detailed design process of the coils is similar to the resonator in [19]. All the chip capacitors used in this research are from KEMET, thus ESRs in capacitors are from KEMET's data sheet [20].…”
Section: System Configuration and Analysismentioning
confidence: 99%
“…The thicknesses of substrate and bare copper are 1.6 mm and 35.6 µm (1-oz copper), respectively. The detailed design process of the coils is similar to the resonator in [19]. All the chip capacitors used in this research are from KEMET, thus ESRs in capacitors are from KEMET's data sheet [20].…”
Section: System Configuration and Analysismentioning
confidence: 99%