2005
DOI: 10.1109/jmems.2005.844845
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Design, fabrication, and characterization of a submicroelectromechanical resonator with monolithically integrated CMOS readout circuit

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Cited by 64 publications
(70 citation statements)
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“…Hence, a built-in interface circuit is required. Several implementations based on the passive integration of I res through C par have been reported in the literature [6,10,11]. However, the resulting integration gain is still strongly dependent on the layout parasitics.…”
Section: Nems Read Out Schemementioning
confidence: 99%
See 1 more Smart Citation
“…Hence, a built-in interface circuit is required. Several implementations based on the passive integration of I res through C par have been reported in the literature [6,10,11]. However, the resulting integration gain is still strongly dependent on the layout parasitics.…”
Section: Nems Read Out Schemementioning
confidence: 99%
“…The basis of the fabrication process is described in [10] and consists of post-processing standard CMOS wafers, where a polysilicon area for nanodevice integration has been reserved. However, the novelty here is the lithography technique employed for patterning the nanodevices: an enhanced resolution down to 200nm and full-wafer parallel processing are obtained [9] by applying nanostencil lithography (nSL) [7].…”
Section: Nems Resonatormentioning
confidence: 99%
“…This strategy simplifies the processing and facilitates the further electrical contact between the nanomechanical devices and the circuits [6].…”
Section: Nanostencil Lithography On Cmos Wafersmentioning
confidence: 99%
“…The interesting features of the spectrum are listed hereafter. The resonance frequency can be tuned by varying the applied dc voltage [6]: it linearly decreases with the squared dc voltage (assuming dc>>ac). This so-called spring-softening effect arises from the electrostatic force acting on the parallel plate capacitor electrode/mechanical device.…”
Section: Cmos Compatibilitymentioning
confidence: 99%
“…However, when decreasing the length scale from micrometers to nanometers, capacitive detection becomes increasingly difficult, due to the reduction of the active capacitance compared to the parasitic ones. An amplifier located very close to the NEMS based transducer could help in reducing the effect of stray capacitance components; 4 however, this approach is usually limited by the complementary metal oxide semiconductor technology constraints. Therefore, alternative sensor concepts have been proposed for NEMSs, 1 of which a sensor based on the electron tunneling effect is especially attractive.…”
Section: Integrated Tunneling Sensor For Nanoelectromechanical Systemsmentioning
confidence: 99%