2022
DOI: 10.3390/pr10091677
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Design and Fabrication Process Optimization of Silver-Based Inkjet-Printed Microheater

Abstract: This paper examines the simulation, design, and fabrication of a nano-particle silver microheater. COMSOL Multiphysics is used to simulate the microheater of an area of 720 × 720 μm2. Different stages of the microheater fabrication process are discussed. The size of the cartridge used is 10 pL and the nozzle diameter was 50 μm. The drop spacing was chosen to be 45 μm after testing several different values. Controlled printing of Ag ink was reached by setting the tickle control frequency to 8 kHz and cartridge … Show more

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Cited by 5 publications
(2 citation statements)
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References 26 publications
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“…[148,149] Conversely, printing using DS less than the ideal results in increased line width as the drops are in close proximity to overlap; thus, compromising pattern integrity. [150] The DS required for IJP depends on the ink-substrate properties. Substrates with lower ink CA (CA i ) can enhance the transition of ink individual beads to continuous line and reduce the number of bulges that often appear when smaller DS is used (Figure 13c).…”
Section: Drop Spacingmentioning
confidence: 99%
“…[148,149] Conversely, printing using DS less than the ideal results in increased line width as the drops are in close proximity to overlap; thus, compromising pattern integrity. [150] The DS required for IJP depends on the ink-substrate properties. Substrates with lower ink CA (CA i ) can enhance the transition of ink individual beads to continuous line and reduce the number of bulges that often appear when smaller DS is used (Figure 13c).…”
Section: Drop Spacingmentioning
confidence: 99%
“…[ 5 , 6 , 7 ], with low material consumption and almost zero waste [ 8 ]. It is effective for the fabrication of a variety of complex electronic components and devices such as: sensors (gas [ 9 , 10 ], temperature [ 11 , 12 , 13 , 14 ], and humidity [ 14 , 15 ]), microheaters [ 16 , 17 , 18 ], energy harvesters, capacitors, FETs, etc. [ 19 , 20 , 21 , 22 ].…”
Section: Introductionmentioning
confidence: 99%