2014 IEEE Conference and Expo Transportation Electrification Asia-Pacific (ITEC Asia-Pacific) 2014
DOI: 10.1109/itec-ap.2014.6941287
View full text |Buy / Rent full text
|
Sign up to set email alerts
|
Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2020
2020
2020
2020

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 5 publications
(1 citation statement)
references
References 7 publications
(1 reference statement)
0
1
0
Order By: Relevance
“…In terms of the thermal resistance reduction, various methods are developed to enhance the thermal properties of the packaging materials and to improve the heat conduction from the dies to the cooling interfaces. In the automotive applications, the dual sided cooled (DSC) technology is considered as the most promising candidate due to the advantages in electrical, thermal, mechanical performance and reliability [33][34][35]. DSC module is believed to have superior electrical and thermal performance, as well as the advantages in volume, weight, and cost.…”
Section: Solutions To Lower Thermal Resistancementioning
confidence: 99%