Deriving lifetime predictions for wire bonds at high temperatures

Hook, Michael David; Hunter, Stevan; Mayer, Michael

doi:10.1016/j.microrel.2018.06.078

Cited by 1 publication

(1 citation statement)

References 17 publications

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“…In order to better predict the wire bonding lifespan, M.D. Hook et al [ 84 ] developed a method to predict the wire bonding lifespan. They analyzed and predicted the bonding of Cu wire and palladium-coated Cu wire on an Al-bonding pad.…”

Section: Application Of Simulation In Cu Wire Bondingmentioning

confidence: 99%

Copper Wire Bonding: A Review

et al. 2023

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This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.

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Section: Application Of Simulation In Cu Wire Bondingmentioning

confidence: 99%